{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T10:12:57Z","timestamp":1725703977085},"reference-count":25,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,3]]},"DOI":"10.1109\/isqed.2012.6187495","type":"proceedings-article","created":{"date-parts":[[2012,4,25]],"date-time":"2012-04-25T20:08:50Z","timestamp":1335384530000},"page":"200-207","source":"Crossref","is-referenced-by-count":4,"title":["On lithography aware metal-fill insertion"],"prefix":"10.1109","author":[{"given":"Vikram B.","family":"Suresh","sequence":"first","affiliation":[]},{"given":"Priyamvada Vijaya","family":"kumar","sequence":"additional","affiliation":[]},{"given":"Sandip","family":"Kundu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"Cadence Design Systems","year":"0","key":"19"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/16.661228"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2004.1358863"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.126"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.802278"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2006.379928"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/UGIM.2003.1225773"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1145\/1118299.1118376"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2000.902552"},{"journal-title":"The EDA Technology Leader - Mentor Graphics","year":"0","key":"21"},{"journal-title":"Synopsys com","year":"0","key":"20"},{"key":"22","first-page":"453","author":"stapper","year":"1983","journal-title":"Integrated circuit yield statistics"},{"key":"23","doi-asserted-by":"publisher","DOI":"10.1147\/rd.285.0636"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1145\/1055137.1055184"},{"key":"25","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI.Design.2010.67"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ICWSI.1992.171820"},{"journal-title":"ITRS Home","year":"0","key":"2"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1116\/1.590901"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/66.475179"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1117\/12.209274"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2009.5090693"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2008.4700576"},{"journal-title":"Fault-Tolerant Systems","year":"0","author":"koren","key":"4"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/12.277291"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.1986.1270182"}],"event":{"name":"2012 13th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2012,3,19]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2012,3,21]]}},"container-title":["Thirteenth International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6182938\/6187454\/06187495.pdf?arnumber=6187495","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T15:59:05Z","timestamp":1490111945000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6187495\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,3]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/isqed.2012.6187495","relation":{},"subject":[],"published":{"date-parts":[[2012,3]]}}}