{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T08:16:38Z","timestamp":1730276198037,"version":"3.28.0"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,3]]},"DOI":"10.1109\/isqed.2012.6187519","type":"proceedings-article","created":{"date-parts":[[2012,4,25]],"date-time":"2012-04-25T20:08:50Z","timestamp":1335384530000},"page":"364-369","source":"Crossref","is-referenced-by-count":1,"title":["Efficient electro-thermal co-analysis on CPU+GPU heterogeneous architecture"],"prefix":"10.1109","author":[{"given":"Huang","family":"Kun","sequence":"first","affiliation":[]},{"given":"Yang","family":"Xu","sequence":"additional","affiliation":[]},{"given":"Zhao","family":"Guoxing","sequence":"additional","affiliation":[]},{"given":"Luo","family":"Zuying","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2006.1594685"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2008.4479852"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2007.4397243"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2005.1560093"},{"key":"ref5","first-page":"10","article-title":"3D Thermal-ADI- An Efficient Chip-Level Transient Thermal Simulator","volume-title":"Proceeding of ISPD, Monteray","volume":"4"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2009.5117999"},{"key":"ref7","first-page":"178","article-title":"GPU Friendly Fast Poisson Solver for Structured Power Grid Network Analysis","volume-title":"Proceeding of 46th DAC","volume":"6"},{"first-page":"661","article-title":"Parallel Multigrid Preconditioning on Graphics Processing Units (GPUs) for Robust Power Grid Analysis","volume-title":"Proceedings of 47th DAC","key":"ref8"},{"first-page":"9","article-title":"Energy-Efficient Real-Time Task Scheduling with Temperature-Dependent Leakage","volume-title":"Proceedings of DATE","key":"ref9"}],"event":{"name":"2012 13th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2012,3,19]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2012,3,21]]}},"container-title":["Thirteenth International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6182938\/6187454\/06187519.pdf?arnumber=6187519","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,23]],"date-time":"2024-01-23T23:26:40Z","timestamp":1706052400000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6187519\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,3]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/isqed.2012.6187519","relation":{},"subject":[],"published":{"date-parts":[[2012,3]]}}}