{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,11]],"date-time":"2026-03-11T17:08:38Z","timestamp":1773248918466,"version":"3.50.1"},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,3]]},"DOI":"10.1109\/isqed.2012.6187543","type":"proceedings-article","created":{"date-parts":[[2012,4,25]],"date-time":"2012-04-25T16:08:50Z","timestamp":1335370130000},"page":"520-524","source":"Crossref","is-referenced-by-count":5,"title":["Chip-package power delivery network resonance analysis and co-design using time and frequency domain analysis techniques"],"prefix":"10.1109","author":[{"given":"Jonathan","family":"Watkins","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jai","family":"Pollayil","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Calvin","family":"Chow","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Aveek","family":"Sarkar","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2004.825834"},{"key":"2","year":"0","journal-title":"ITRS Projections"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1146964"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/43.709396"},{"key":"6","article-title":"Power Noise Analysis for Next Generation IC's","author":"sarkar","year":"0","journal-title":"Apache Design Inc White Paper"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2007.4387176"},{"key":"4","year":"0","journal-title":"ITRS Projections"}],"event":{"name":"2012 13th International Symposium on Quality Electronic Design (ISQED)","location":"Santa Clara, CA, USA","start":{"date-parts":[[2012,3,19]]},"end":{"date-parts":[[2012,3,21]]}},"container-title":["Thirteenth International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6182938\/6187454\/06187543.pdf?arnumber=6187543","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T10:24:35Z","timestamp":1490091875000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6187543\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,3]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/isqed.2012.6187543","relation":{},"subject":[],"published":{"date-parts":[[2012,3]]}}}