{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T08:17:01Z","timestamp":1730276221877,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,3]]},"DOI":"10.1109\/isqed.2014.6783322","type":"proceedings-article","created":{"date-parts":[[2014,4,16]],"date-time":"2014-04-16T17:24:16Z","timestamp":1397669056000},"page":"179-183","source":"Crossref","is-referenced-by-count":1,"title":["3D-ICs with self-healing capability for thermal effects in RF circuits"],"prefix":"10.1109","author":[{"given":"Abhilash","family":"Goyal","sequence":"first","affiliation":[]},{"given":"Madhavan","family":"Swaminathan","sequence":"additional","affiliation":[]},{"given":"Abhijit","family":"Chatterjee","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","first-page":"658","article-title":"Non-uniform microchannel design for stacked 3d-ics","author":"bing","year":"2011","journal-title":"Proc Design Automation Conference (DAC)"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2003.1257591"},{"journal-title":"Thermal Issues of 3D ICs","year":"0","author":"fukushmia","key":"1"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2011.5940683"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2009.5090929"},{"key":"4","first-page":"1","article-title":"3d floorplanning with thermal vias","volume":"1","author":"eric","year":"0","journal-title":"IEEEi Proc Design Automation and Test in Europe 2006 DATE '06 Proceedings"}],"event":{"name":"2014 15th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2014,3,3]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2014,3,5]]}},"container-title":["Fifteenth International Symposium on Quality Electronic Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6779216\/6783285\/06783322.pdf?arnumber=6783322","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T12:51:07Z","timestamp":1490273467000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6783322\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,3]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isqed.2014.6783322","relation":{},"subject":[],"published":{"date-parts":[[2014,3]]}}}