{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T06:51:40Z","timestamp":1729666300633,"version":"3.28.0"},"reference-count":27,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,3]]},"DOI":"10.1109\/isqed.2014.6783388","type":"proceedings-article","created":{"date-parts":[[2014,4,16]],"date-time":"2014-04-16T21:24:16Z","timestamp":1397683456000},"page":"645-652","source":"Crossref","is-referenced-by-count":5,"title":["Thermal hotspot reduction in mm-Wave wireless NoC architectures"],"prefix":"10.1109","author":[{"given":"Jacob","family":"Murray","sequence":"first","affiliation":[]},{"given":"Paul","family":"Wettin","sequence":"additional","affiliation":[]},{"given":"Ryan","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Xinmin","family":"Yu","sequence":"additional","affiliation":[]},{"given":"Partha Pratim","family":"Pande","sequence":"additional","affiliation":[]},{"given":"Behrooz","family":"Shirazi","sequence":"additional","affiliation":[]},{"given":"Deukhyoun","family":"Heo","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.852438"},{"key":"17","first-page":"88","article-title":"A deadlock-free routing scheme for interconnection networks with irregular topology","author":"chi","year":"0","journal-title":"Proc of ICPADS"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/CCGrid.2012.62"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2005.134"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2006.12"},{"key":"13","article-title":"Design of an energy efficient CMOS compatible NoC architecture with millimeter-wave wireless interconnects","author":"deb","year":"2012","journal-title":"IEEE Trans Comput"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2008.4771803"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1038\/30918"},{"key":"12","article-title":"Spatial small-world networks: A wiring cost perspective","author":"petermann","year":"0","journal-title":"Arxiv Condmat\/ 0501420v2"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1145\/2024716.2024718"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1109\/4.997846"},{"key":"22","doi-asserted-by":"crossref","first-page":"24","DOI":"10.1109\/ISCA.1995.524546","article-title":"The SPLASH-2 programs: characterization and methodological considerations","author":"woo","year":"1995","journal-title":"Proceedings 22nd Annual International Symposium on Computer Architecture ISCA"},{"journal-title":"Benchmarking Modern Multiprocessors","year":"2011","author":"bienia","key":"23"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"key":"25","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"Temperature-Aware microarchitecture","author":"skadron","year":"2003","journal-title":"Proc of the International Symposium on Computer Architecture"},{"key":"26","doi-asserted-by":"publisher","DOI":"10.1145\/2491676"},{"key":"27","article-title":"Realistic workload characterization and analysis for networks-on-chip design","author":"gratz","year":"2010","journal-title":"In the 2nd Workshop on Chip Multiprocessor Memory Systems and Interconnects (CMP-MSI)"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2007.1092"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687458"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.156"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2012.2193835"},{"key":"7","doi-asserted-by":"crossref","first-page":"80","DOI":"10.1109\/MM.2008.18","article-title":"Toward ideal on-chip communication using express virtual channels","volume":"28","author":"kumar","year":"2008","journal-title":"IEEE Micro"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.878263"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2005.1560072"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.2010691"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2013.6523601"},{"key":"8","article-title":"Temperature-Aware on-chip networks","author":"shang","year":"2006","journal-title":"IEEE Micro Micro's Top Picks from Computer Architecture Conferences"}],"event":{"name":"2014 15th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2014,3,3]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2014,3,5]]}},"container-title":["Fifteenth International Symposium on Quality Electronic Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6779216\/6783285\/06783388.pdf?arnumber=6783388","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,12]],"date-time":"2023-07-12T05:41:57Z","timestamp":1689140517000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6783388\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,3]]},"references-count":27,"URL":"https:\/\/doi.org\/10.1109\/isqed.2014.6783388","relation":{},"subject":[],"published":{"date-parts":[[2014,3]]}}}