{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T09:52:47Z","timestamp":1729677167252,"version":"3.28.0"},"reference-count":27,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,3]]},"DOI":"10.1109\/isqed.2014.6783395","type":"proceedings-article","created":{"date-parts":[[2014,4,16]],"date-time":"2014-04-16T17:24:16Z","timestamp":1397669056000},"page":"700-707","source":"Crossref","is-referenced-by-count":10,"title":["Statistical analysis of process variation induced SRAM electromigration degradation"],"prefix":"10.1109","author":[{"given":"Zhong","family":"Guan","sequence":"first","affiliation":[]},{"given":"Malgorzata","family":"Marek-Sadowska","sequence":"additional","affiliation":[]},{"given":"Sani","family":"Nassif","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1063\/1.2196114"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/66.827347"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/16.725264"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"16","doi-asserted-by":"crossref","first-page":"3236","DOI":"10.1063\/1.1418034","article-title":"Electromigration critical length effect in Cu-oxide dual damascene interconnect","volume":"79","author":"lee","year":"2009","journal-title":"Appl Phys Let s"},{"key":"13","article-title":"An electromigration failure model for interconnects under pulsed and bidirectional current stressing","volume":"41","author":"tao","year":"1994","journal-title":"IEEE Trans on Electr Dev"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1969.16754"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/ACQED.2012.6320474"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1145\/2451916.2451925"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2007.4418975"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.884077"},{"journal-title":"Advanced MOSFET designs and implications for SRAM scaling","year":"2011","author":"shin","key":"22"},{"key":"23","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2020721"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-19568-6_2"},{"key":"25","doi-asserted-by":"publisher","DOI":"10.1063\/1.1355304"},{"key":"26","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1146928"},{"key":"27","article-title":"Variation-Tolerant cache by twolayer error control codes","author":"zhang","year":"2013","journal-title":"Int Symp on Defect and Fault Tolerance in VLSI and Nano System (DFT"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2013.6523624"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1989.203510"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2007.4405720"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1088\/0034-4885\/52\/3\/002"},{"journal-title":"Process integration devices and structures (PIDS)","year":"0","key":"7"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2043694"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2008.2004323"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/16.333844"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/DDECS.2011.5783112"},{"key":"8","article-title":"Process variation and randomdopant-induced static noise margin fluctuation in nanoscale cmos and finfet sram cells","author":"li","year":"2009","journal-title":"Asia Symp on Qual Electr Des (ASQED"}],"event":{"name":"2014 15th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2014,3,3]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2014,3,5]]}},"container-title":["Fifteenth International Symposium on Quality Electronic Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6779216\/6783285\/06783395.pdf?arnumber=6783395","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,22]],"date-time":"2017-06-22T07:43:24Z","timestamp":1498117404000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6783395\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,3]]},"references-count":27,"URL":"https:\/\/doi.org\/10.1109\/isqed.2014.6783395","relation":{},"subject":[],"published":{"date-parts":[[2014,3]]}}}