{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T09:12:01Z","timestamp":1725441121370},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,3]]},"DOI":"10.1109\/isqed.2016.7479215","type":"proceedings-article","created":{"date-parts":[[2016,5,26]],"date-time":"2016-05-26T16:27:41Z","timestamp":1464280061000},"page":"284-288","source":"Crossref","is-referenced-by-count":1,"title":["Decomposition technologies for advanced nodes"],"prefix":"10.1109","author":[{"given":"Fedor G","family":"Pikus","sequence":"first","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1117\/12.814435"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681619"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2010.5450394"},{"key":"ref13","article-title":"Design-overlay interactions in metal double patterning","author":"ghaida","year":"2009","journal-title":"SPIE Advanced Lithography International Society for Optics and Photonics"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2035577"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1117\/12.879500"},{"key":"ref3","article-title":"The economic impact of EUV lithography on critical process modules","author":"arindam","year":"2014","journal-title":"Proceedings of SPIE 9048 Extreme Ultraviolet (EUV) Lithography V"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2015.7059085"},{"key":"ref5","article-title":"Multi-Patterning Rollout - What's Coming When?","author":"bryon","year":"2014","journal-title":"Electrical Engineering in Japan"},{"key":"ref8","article-title":"Layout Decomposition for Double Patterning Lithography","author":"andrew","year":"2008","journal-title":"Proc of ICC 08"},{"key":"ref7","article-title":"Self-aligned double patterning - part deux","author":"abercrombie","year":"2015","journal-title":"Semiconductor Engineering"},{"key":"ref2","article-title":"Directed Self-Assembly of Block Copolymers for nano-manufacturing","author":"gronheid","year":"2015","journal-title":"Woodhead Publishing"},{"key":"ref1","article-title":"VLSI CAD for Emerging Nanolithography","author":"david","year":"2012","journal-title":"International Symposium on VLSI Design Automation and Test (VLSI-DAT)"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1117\/12.778267"}],"event":{"name":"2016 17th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2016,3,15]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2016,3,16]]}},"container-title":["2016 17th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7470728\/7479140\/07479215.pdf?arnumber=7479215","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,9,23]],"date-time":"2016-09-23T15:59:10Z","timestamp":1474646350000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7479215\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,3]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/isqed.2016.7479215","relation":{},"subject":[],"published":{"date-parts":[[2016,3]]}}}