{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T22:46:29Z","timestamp":1747867589731,"version":"3.28.0"},"reference-count":20,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,3]]},"DOI":"10.1109\/isqed.2016.7479241","type":"proceedings-article","created":{"date-parts":[[2016,5,26]],"date-time":"2016-05-26T16:27:41Z","timestamp":1464280061000},"page":"443-449","source":"Crossref","is-referenced-by-count":1,"title":["AFD-based method for signal line EM reliability evaluation"],"prefix":"10.1109","author":[{"given":"Zhong","family":"Guan","sequence":"first","affiliation":[]},{"given":"Malgorzata","family":"Marek-Sadowska","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2012.6241869"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1063\/1.2761434"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691144"},{"key":"ref13","article-title":"Compact Modeling and SPICE-Based simulation for Electrothermal Analysis of Multilevel ULSI Interconnects","author":"chiang","year":"2001","journal-title":"ICCAD"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2005.10.079"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2160882"},{"journal-title":"International Technology Roadmap for Semiconductors","article-title":"Interconnect Report","year":"2012","key":"ref16"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.884077"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2013.6615556"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2014.6783395"},{"key":"ref4","doi-asserted-by":"crossref","first-page":"476","DOI":"10.1109\/55.468272","article-title":"Modeling Electromigration Lifetime Under Bidirectional Current Stress","volume":"16","author":"tao","year":"1995","journal-title":"IEEE Trans on Electr Dev"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.1993.283282"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2015.7059029"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2013.6509650"},{"key":"ref8","article-title":"Electromigration-A brief survey and some recent results","volume":"ed 16","author":"black","year":"1969","journal-title":"IEEE Trans on El Dev"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2014.6831886"},{"key":"ref2","article-title":"Static electromigration analysis for signal interconnects","author":"oh","year":"2003","journal-title":"ISQED"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2010.5488755"},{"key":"ref9","article-title":"Electromigration threshold for Cu\/low k interconnects","author":"lee","year":"2003","journal-title":"IITC"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2014.7050077"}],"event":{"name":"2016 17th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2016,3,15]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2016,3,16]]}},"container-title":["2016 17th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7470728\/7479140\/07479241.pdf?arnumber=7479241","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,24]],"date-time":"2017-06-24T11:08:48Z","timestamp":1498302528000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7479241\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,3]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/isqed.2016.7479241","relation":{},"subject":[],"published":{"date-parts":[[2016,3]]}}}