{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,23]],"date-time":"2026-04-23T14:45:51Z","timestamp":1776955551054,"version":"3.51.4"},"reference-count":23,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,3]]},"DOI":"10.1109\/isqed.2017.7918301","type":"proceedings-article","created":{"date-parts":[[2017,5,4]],"date-time":"2017-05-04T20:32:38Z","timestamp":1493929958000},"page":"104-110","source":"Crossref","is-referenced-by-count":2,"title":["Performance- and energy-aware optimization of BEOL interconnect stack geometry in advanced technology nodes"],"prefix":"10.1109","author":[{"family":"Kwangsoo Han","sequence":"first","affiliation":[]},{"given":"Andrew B.","family":"Kahng","sequence":"additional","affiliation":[]},{"family":"Hyein Lee","sequence":"additional","affiliation":[]},{"family":"Lutong Wang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"227","article-title":"Line Width Dependence of Copper Resistivity","author":"jiang","year":"2001","journal-title":"Proc Interconnect Technology Conf"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2006.346879"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICVD.2001.902709"},{"key":"ref13","author":"shah","year":"2015","journal-title":"Optimization of the BEOL Interconnect Stack for Advanced Semiconductor Technology Nodes"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/16.902722"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1996.545648"},{"key":"ref16","author":"zhu","year":"2014","journal-title":"Back End of Line (BEOL) Local Optimization to Improve Product Performance"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2010.2047238"},{"key":"ref18","year":"0","journal-title":"Cadence Innovus User Guide"},{"key":"ref19","year":"0","journal-title":"Cadence Quantus QRC User Guide"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2554561"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1985.22046"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2304514"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2002.1057945"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/43.822622"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2003.159753"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/16.817584"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/43.736565"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2012.6478969"},{"key":"ref20","year":"0","journal-title":"International Technology Roadmap for Semiconductors"},{"key":"ref22","year":"0","journal-title":"OpenCores Open Source IP-Cores"},{"key":"ref21","year":"0","journal-title":"LEF DEF reference 5 7"},{"key":"ref23","year":"0","journal-title":"Synopsys HSPICE User Guide"}],"event":{"name":"2017 18th International Symposium on Quality Electronic Design (ISQED)","location":"Santa Clara, CA, USA","start":{"date-parts":[[2017,3,14]]},"end":{"date-parts":[[2017,3,15]]}},"container-title":["2017 18th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7910185\/7918273\/07918301.pdf?arnumber=7918301","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,5,22]],"date-time":"2017-05-22T21:54:41Z","timestamp":1495490081000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7918301\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,3]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/isqed.2017.7918301","relation":{},"subject":[],"published":{"date-parts":[[2017,3]]}}}