{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T08:03:29Z","timestamp":1729670609726,"version":"3.28.0"},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,3]]},"DOI":"10.1109\/isqed.2017.7918355","type":"proceedings-article","created":{"date-parts":[[2017,5,4]],"date-time":"2017-05-04T16:32:38Z","timestamp":1493915558000},"page":"438-444","source":"Crossref","is-referenced-by-count":0,"title":["Cost-quality trade-offs of approximate memory repair mechanisms for image data"],"prefix":"10.1109","author":[{"family":"Qianqian Fan","sequence":"first","affiliation":[]},{"given":"Sachin S.","family":"Sapatnekar","sequence":"additional","affiliation":[]},{"given":"David J.","family":"Lilja","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"Cacti Tools","year":"0","key":"ref10"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2012.6401576"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/54.748806"},{"journal-title":"Testing Semiconductor Memories Theory and Practice","year":"1991","author":"van de goor","key":"ref13"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2005.863189"},{"journal-title":"DDR3-SDRAM data sheet","year":"0","key":"ref15"},{"journal-title":"STT-MRAM data sheet","year":"0","key":"ref16"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.864128"},{"journal-title":"NVsim tools","year":"0","key":"ref18"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2008996"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"742","DOI":"10.1109\/TVLSI.2005.848824","article-title":"A built-in self-repair design for RAMs with 2-D redundancy","volume":"13","author":"li","year":"2005","journal-title":"IEEE Transactions on VLSI Systems"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/5.705525"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-9551-3"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2744871"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/2644808"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/RAMS.2011.5754515"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1555349.1555372"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7958-2"}],"event":{"name":"2017 18th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2017,3,14]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2017,3,15]]}},"container-title":["2017 18th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7910185\/7918273\/07918355.pdf?arnumber=7918355","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,23]],"date-time":"2019-09-23T05:37:26Z","timestamp":1569217046000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7918355\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,3]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/isqed.2017.7918355","relation":{},"subject":[],"published":{"date-parts":[[2017,3]]}}}