{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,24]],"date-time":"2025-12-24T12:16:03Z","timestamp":1766578563498},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,3]]},"DOI":"10.1109\/isqed.2018.8357278","type":"proceedings-article","created":{"date-parts":[[2018,5,18]],"date-time":"2018-05-18T17:30:27Z","timestamp":1526664627000},"page":"138-143","source":"Crossref","is-referenced-by-count":9,"title":["Network on interconnect fabric"],"prefix":"10.1109","author":[{"given":"Boris","family":"Vaisband","sequence":"first","affiliation":[]},{"given":"Adeel","family":"Bajwa","sequence":"additional","affiliation":[]},{"given":"Subramanian S.","family":"Iyer","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2615051"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2611497"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2017.246"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2493512"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2405614"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2015.7169101"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2007.907263"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2016.7573462"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2017.240"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2015.2511626"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2006.1645716"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2002.1016885"},{"journal-title":"High Performance Integrated Circuits","year":"2012","author":"salman","key":"ref8"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2007.373774"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2017.8309199"},{"journal-title":"3-D ICs as a Platform for Heterogeneous Systems Integration","year":"2017","author":"vaisband","key":"ref1"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-29395-0"}],"event":{"name":"2018 19th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2018,3,13]]},"location":"Santa Clara, CA","end":{"date-parts":[[2018,3,14]]}},"container-title":["2018 19th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8354411\/8357243\/08357278.pdf?arnumber=8357278","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,6,1]],"date-time":"2018-06-01T16:21:11Z","timestamp":1527870071000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8357278\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,3]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/isqed.2018.8357278","relation":{},"subject":[],"published":{"date-parts":[[2018,3]]}}}