{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,21]],"date-time":"2026-02-21T18:21:07Z","timestamp":1771698067911,"version":"3.50.1"},"reference-count":44,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,4,5]],"date-time":"2023-04-05T00:00:00Z","timestamp":1680652800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,4,5]],"date-time":"2023-04-05T00:00:00Z","timestamp":1680652800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,4,5]]},"DOI":"10.1109\/isqed57927.2023.10129359","type":"proceedings-article","created":{"date-parts":[[2023,5,24]],"date-time":"2023-05-24T17:33:09Z","timestamp":1684949589000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Security and Reliability Challenges in Machine Learning for EDA: Latest Advances"],"prefix":"10.1109","author":[{"given":"Zhiyao","family":"Xie","sequence":"first","affiliation":[{"name":"Hong Kong University of Science and Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tao","family":"Zhang","sequence":"additional","affiliation":[{"name":"Hong Kong University of Science and Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yifeng","family":"Peng","sequence":"additional","affiliation":[{"name":"Hong Kong University of Science and Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024914"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1145\/3394885.3431562"},{"key":"ref12","year":"2020","journal-title":"As chip design costs skyrocket 3nm process node is in jeopardy"},{"key":"ref34","article-title":"Pre-Placement Net Length and Timing Estimation by Customized Graph Neural Network","author":"xie","year":"2022","journal-title":"TCAD"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415712"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045574"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.3850\/9783981537079_0923"},{"key":"ref36","article-title":"The Dark Side: Security and Reliability Concerns in Machine Learning for EDA","author":"xie","year":"2022","journal-title":"TCAD"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045201"},{"key":"ref30","year":"2021","journal-title":"DSO ai AI-Driven Design Applications"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8715126"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1145\/3508352.3549427"},{"key":"ref10","author":"huang","year":"2021","journal-title":"Machine learning for electronic design automation A survey"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/3240765.3240843"},{"key":"ref2","year":"2021","journal-title":"Cadence Cerebrus intelligent chip explorer"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317857"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116489"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317930"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488795"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1145\/3466752.3480064"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/3408288"},{"key":"ref18","article-title":"Bias Busters: Robustifying DL-based Lithographic Hotspot Detectors Against Backdooring Attacks","author":"liu","year":"2020","journal-title":"TCAD"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-021-03544-w"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317838"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/3508352.3549389"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2019.00929"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116330"},{"key":"ref42","article-title":"Developing synthesis flows without human knowledge","author":"yu","year":"2018","journal-title":"DAC"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1145\/3394885.3431571"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218582"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317884"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD45719.2019.8942063"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415714"},{"key":"ref28","article-title":"Para-Graph: Layout parasitics and device parameter prediction using graph neural networks","author":"ren","year":"2020","journal-title":"DAC"},{"key":"ref27","article-title":"MLCAD: A Survey of Research in Machine Learning for CAD Keynote Paper","author":"rapp","year":"2021","journal-title":"TCAD"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2007.907232"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD45719.2019.8942062"},{"key":"ref7","author":"goodfellow","year":"2014","journal-title":"Explaining and Harnessing Adversarial Examples"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045559"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD51958.2021.9643483"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/3566097.3567896"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/FCCM.2018.00029"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415662"},{"key":"ref40","article-title":"Layout hotspot detection with feature tensor generation and deep biased learning","author":"yang","year":"2018","journal-title":"TCAD"}],"event":{"name":"2023 24th International Symposium on Quality Electronic Design (ISQED)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,4,5]]},"end":{"date-parts":[[2023,4,7]]}},"container-title":["2023 24th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10129281\/10129282\/10129359.pdf?arnumber=10129359","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,19]],"date-time":"2023-06-19T17:44:56Z","timestamp":1687196696000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10129359\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,4,5]]},"references-count":44,"URL":"https:\/\/doi.org\/10.1109\/isqed57927.2023.10129359","relation":{},"subject":[],"published":{"date-parts":[[2023,4,5]]}}}