{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,13]],"date-time":"2026-06-13T00:14:31Z","timestamp":1781309671872,"version":"3.54.1"},"reference-count":34,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,4,23]],"date-time":"2025-04-23T00:00:00Z","timestamp":1745366400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,23]],"date-time":"2025-04-23T00:00:00Z","timestamp":1745366400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["2219679,2219680"],"award-info":[{"award-number":["2219679,2219680"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,4,23]]},"DOI":"10.1109\/isqed65160.2025.11014346","type":"proceedings-article","created":{"date-parts":[[2025,5,30]],"date-time":"2025-05-30T17:43:30Z","timestamp":1748627010000},"page":"1-8","source":"Crossref","is-referenced-by-count":7,"title":["Matter: Multi-Stage Adaptive Thermal Trojan for Efficiency & Resilience Degradation"],"prefix":"10.1109","author":[{"given":"Mehdi","family":"Elahi","sequence":"first","affiliation":[{"name":"North Carolina A&T State University,Department of Computer Systems Technology,NC,27411"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mohamed R.","family":"Elshamy","sequence":"additional","affiliation":[{"name":"Klipsch School of ECE, New Mexico State University,NM,88003"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Abdel-Hameed","family":"Badawy","sequence":"additional","affiliation":[{"name":"Klipsch School of ECE, New Mexico State University,NM,88003"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mahdi","family":"Fazeli","sequence":"additional","affiliation":[{"name":"Halmstad University,Sweden"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ahmad","family":"Patooghy","sequence":"additional","affiliation":[{"name":"North Carolina A&T State University,Department of Computer Systems Technology,NC,27411"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/3498361.3538948"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3342701"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/3356045.3360716"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/igsc64514.2024.00038"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ipccc59868.2024.10850172"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2878168"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2023.120079"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/EMPDP.2019.8671643"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2646798"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2019.114832"},{"key":"ref11","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1109\/ICOA55659.2022.9934719","article-title":"Fem-based thermal profile prediction for thermal management of system-on-chips","volume-title":"2022 8th International Conference on Optimization and Applications (ICOA)","author":"Oukaira","year":"2022"},{"issue":"4","key":"ref12","first-page":"304","article-title":"Untrimmed low-power thermal sensor for soc in 22 nm digital fabrication technology","volume-title":"Journal of Low Power Electronics and Applications","volume":"4","author":"Eitan","year":"2014"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2023.3280134"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3012833"},{"key":"ref15","article-title":"Auto-matic hardware trojan insertion using machine learning","author":"Cruz","year":"2022","journal-title":"arXiv preprint"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED54688.2022.9806243"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/IGCC.2018.8752140"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681582"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2061310"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3047020"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2020.2994627"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt.2018.5108"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/2660267.2660289"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1201\/b17555"},{"key":"ref25","author":"Kedia","year":"2022","journal-title":"Comet: An integrated interval thermal simulation toolchain for 2d, 2.5 d, and 3d processor-memory systems"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/2063384.2063454"},{"key":"ref27","doi-asserted-by":"crossref","first-page":"469","DOI":"10.1145\/1669112.1669172","article-title":"Mcpat: An integrated power, area, and timing modeling framework for multicore and manycore architectures","volume-title":"Proceedings of the 42nd annual ieee\/acm international symposium on microarchitecture","author":"Li","year":"2009"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/3085572"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref30","volume-title":"Intel\u00ae Xeon\u00ae Processor X5550 product specification","year":"2024"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/225830.223990"},{"key":"ref32","doi-asserted-by":"crossref","first-page":"72","DOI":"10.1145\/1454115.1454128","article-title":"The parsec benchmark suite: Characterization and architectural implications","volume-title":"Proceedings of the 17th international conference on Parallel architectures and compilation techniques","author":"Bienia","year":"2008"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2005.1412184"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1145\/3126567"}],"event":{"name":"2025 26th International Symposium on Quality Electronic Design (ISQED)","location":"San Francisco, CA, USA","start":{"date-parts":[[2025,4,23]]},"end":{"date-parts":[[2025,4,25]]}},"container-title":["2025 26th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11014297\/11014302\/11014346.pdf?arnumber=11014346","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,31]],"date-time":"2025-05-31T04:58:13Z","timestamp":1748667493000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11014346\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4,23]]},"references-count":34,"URL":"https:\/\/doi.org\/10.1109\/isqed65160.2025.11014346","relation":{},"subject":[],"published":{"date-parts":[[2025,4,23]]}}}