{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,1]],"date-time":"2025-06-01T04:08:16Z","timestamp":1748750896939,"version":"3.41.0"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,4,23]],"date-time":"2025-04-23T00:00:00Z","timestamp":1745366400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,23]],"date-time":"2025-04-23T00:00:00Z","timestamp":1745366400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,4,23]]},"DOI":"10.1109\/isqed65160.2025.11014436","type":"proceedings-article","created":{"date-parts":[[2025,5,30]],"date-time":"2025-05-30T17:43:30Z","timestamp":1748627010000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Thermal Model Extraction at Chip Boundaries for Thermal Simulation of Chip in a System"],"prefix":"10.1109","author":[{"given":"Kai-Xiang","family":"Lin","sequence":"first","affiliation":[{"name":"National Yang Ming Chiao Tung University,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Min","family":"Lee","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bo-Yi","family":"Tsai","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.882589"},{"key":"ref2","article-title":"HotSpot 6.0: Validation, acceleration and extension","author":"Zhang","year":"2015","journal-title":"University of Virginia, Technical Report"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2401578"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3074613"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3048835"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1049\/cdt2.12052"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9780511541117"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.1989.77002"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2003.1206984"},{"volume-title":"Intel Math Kernel Library PARDISO library","key":"ref10"},{"volume-title":"ANSYS Icepak","key":"ref11"},{"volume-title":"Examples of Therminator","key":"ref12"},{"volume-title":"iFixit GS4 teardown","key":"ref13"},{"volume-title":"OppoA55 Specifications","key":"ref14"}],"event":{"name":"2025 26th International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2025,4,23]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2025,4,25]]}},"container-title":["2025 26th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11014297\/11014302\/11014436.pdf?arnumber=11014436","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,31]],"date-time":"2025-05-31T04:45:23Z","timestamp":1748666723000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11014436\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4,23]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/isqed65160.2025.11014436","relation":{},"subject":[],"published":{"date-parts":[[2025,4,23]]}}}