{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,29]],"date-time":"2026-05-29T05:03:35Z","timestamp":1780031015524,"version":"3.53.1"},"reference-count":23,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T00:00:00Z","timestamp":1775606400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T00:00:00Z","timestamp":1775606400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,8]]},"DOI":"10.1109\/isqed69900.2026.11534661","type":"proceedings-article","created":{"date-parts":[[2026,5,28]],"date-time":"2026-05-28T22:26:58Z","timestamp":1780007218000},"page":"1-7","source":"Crossref","is-referenced-by-count":0,"title":["Efficient High-Sigma Yield Analysis based on the Deep Ensemble Framework with Active learning and Augmentation"],"prefix":"10.1109","author":[{"given":"Younghun","family":"Park","sequence":"first","affiliation":[{"name":"Sogang University,Department of CS & Engineering,Seoul,Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kanghun","family":"Kim","sequence":"additional","affiliation":[{"name":"Sogang University,Department of CS & Engineering,Seoul,Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jun Seo","family":"Jung","sequence":"additional","affiliation":[{"name":"Sogang University,Department of CS & Engineering,Seoul,Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daehwan","family":"Lho","sequence":"additional","affiliation":[{"name":"SK Hynix Inc.,DRAM Circuit Design,Icheon,Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Honggyoo","family":"Ahn","sequence":"additional","affiliation":[{"name":"SK Hynix Inc.,DRAM Circuit Design,Icheon,Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Woncheol","family":"Lee","sequence":"additional","affiliation":[{"name":"SK Hynix Inc.,DRAM Circuit Design,Icheon,Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Taehoon","family":"Kim","sequence":"additional","affiliation":[{"name":"SK Hynix Inc.,DRAM Circuit Design,Icheon,Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Juho","family":"Kim","sequence":"additional","affiliation":[{"name":"Sogang University,Department of CS & Engineering,Seoul,Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2336851"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681593"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2010.5456940"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.2966481"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3067510"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2007.364490"},{"key":"ref7","first-page":"1","article-title":"REscope: High-dimensional statistical circuit simulation towards full failure region coverage","volume-title":"Proc. Design Autom. Conf. (DAC)","author":"Wu"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3225066"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2778061"},{"key":"ref10","first-page":"283","article-title":"High-dimensional yield estimation using shrinkage deep features and maximization of integral entropy reduction","volume-title":"Proc. Asia South Pacific Design Autom. Conf. (ASPDAC)","author":"Yin"},{"key":"ref11","article-title":"A study of Bayesian neural network surrogates for Bayesian optimization","author":"Li","year":"2023","journal-title":"arXiv"},{"key":"ref12","article-title":"Deep Ensembles from a Bayesian perspective","author":"Hoffmann","year":"2021","journal-title":"arXiv"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1287\/educ.2018.0188"},{"key":"ref14","first-page":"1183","article-title":"Deep Bayesian active learning with image data","volume-title":"Proc. Int. Conf. Mach. Learn. (ICML)","author":"Gal"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2024.124118"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-40669-0_33"},{"key":"ref17","first-page":"7024","article-title":"BatchBALD: Efficient and diverse batch acquisition for deep Bayesian active learning","volume":"32","author":"Kirsch","year":"2019","journal-title":"Adv. Neural Inf. Process. Syst. (NeurIPS)"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.1999.759251"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2015.2418155"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/MSE.2009.5270840"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2002.808305"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.23919\/DATE54114.2022.9774735"},{"key":"ref23","doi-asserted-by":"crossref","DOI":"10.1145\/3316781.3317863","article-title":"Meta-model based high-dimensional yield analysis using low-rank tensor approximation","volume-title":"Proc. Design Autom. Conf. (DAC)","author":"Shi"}],"event":{"name":"2026 27th International Symposium on Quality Electronic Design (ISQED)","location":"San Francisco, CA, USA","start":{"date-parts":[[2026,4,8]]},"end":{"date-parts":[[2026,4,10]]}},"container-title":["2026 27th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11534651\/11534652\/11534661.pdf?arnumber=11534661","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,5,29]],"date-time":"2026-05-29T04:24:29Z","timestamp":1780028669000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11534661\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,8]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/isqed69900.2026.11534661","relation":{},"subject":[],"published":{"date-parts":[[2026,4,8]]}}}