{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,29]],"date-time":"2026-05-29T05:03:49Z","timestamp":1780031029029,"version":"3.53.1"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T00:00:00Z","timestamp":1775606400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T00:00:00Z","timestamp":1775606400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,4,8]]},"DOI":"10.1109\/isqed69900.2026.11534716","type":"proceedings-article","created":{"date-parts":[[2026,5,28]],"date-time":"2026-05-28T22:26:58Z","timestamp":1780007218000},"page":"1-8","source":"Crossref","is-referenced-by-count":0,"title":["Design for Manufacturing and Assembly for Heterogeneous Integration Using Micro-Transfer Printing"],"prefix":"10.1109","author":[{"given":"Robert","family":"Fischbach","sequence":"first","affiliation":[{"name":"Dresden University of Technology,Dresden,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ronny","family":"Frevert","sequence":"additional","affiliation":[{"name":"X-FAB Dresden GmbH & Co. KG,Dresden,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Andreas","family":"Krinke","sequence":"additional","affiliation":[{"name":"Dresden University of Technology,Dresden,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sebastian","family":"Wicht","sequence":"additional","affiliation":[{"name":"X-FAB Semiconductor Foundries,Erfurt,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jens","family":"Lienig","sequence":"additional","affiliation":[{"name":"Dresden University of Technology,Dresden,Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"issue":"737465","key":"ref1","first-page":"2017","article-title":"Pilot line for micro-transfer-printing of functional components on wafer level (MICROPRINCE)"},{"key":"ref2","first-page":"2022","article-title":"Verteilte Fertigung f\u00fcr neuartige und vertrauensw\u00fcrdige Elektronik (T4T)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/iedm45625.2022.10019534"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/iedm45625.2022.10019355"},{"key":"ref5","first-page":"1","article-title":"Manufacturing capability of micro-transfer printing","volume-title":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","author":"Gomez"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2872334.2872335"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1063\/5.0181099"},{"key":"ref8","first-page":"1","article-title":"MICROPRINCE: Open access pilot line for micro-transfer-printing of functional components on wafer level","volume-title":"Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems","author":"Wicht"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/essderc.2019.8901793"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/aspdac.2018.8297375"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/3dic48104.2019.9058886"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1038\/s41377-020-0341-9"}],"event":{"name":"2026 27th International Symposium on Quality Electronic Design (ISQED)","location":"San Francisco, CA, USA","start":{"date-parts":[[2026,4,8]]},"end":{"date-parts":[[2026,4,10]]}},"container-title":["2026 27th International Symposium on Quality Electronic Design (ISQED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11534651\/11534652\/11534716.pdf?arnumber=11534716","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,5,29]],"date-time":"2026-05-29T04:25:20Z","timestamp":1780028720000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11534716\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,8]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/isqed69900.2026.11534716","relation":{},"subject":[],"published":{"date-parts":[[2026,4,8]]}}}