{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,20]],"date-time":"2025-04-20T01:51:02Z","timestamp":1745113862049},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,2]]},"DOI":"10.1109\/isscc.2008.4523175","type":"proceedings-article","created":{"date-parts":[[2008,5,21]],"date-time":"2008-05-21T15:39:02Z","timestamp":1211384342000},"page":"298-614","source":"Crossref","is-referenced-by-count":47,"title":["An 11Gb\/s Inductive-Coupling Link with Burst Transmission"],"prefix":"10.1109","author":[{"given":"Noriyuki","family":"Miura","sequence":"first","affiliation":[]},{"given":"Yoshinori","family":"Kohama","sequence":"additional","affiliation":[]},{"given":"Yasufumi","family":"Sugimori","sequence":"additional","affiliation":[]},{"given":"Hiroki","family":"Ishikuro","sequence":"additional","affiliation":[]},{"given":"Takayasu","family":"Sakurai","sequence":"additional","affiliation":[]},{"given":"Tadahiro","family":"Kuroda","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373400"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2000.839692"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.886554"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2005.1493970"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2002.1012783"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2006.320976"},{"key":"1","first-page":"448","article-title":"two 10gb\/s\/pin low-power interconnect methods for 3d ics","author":"gu","year":"2007","journal-title":"ISSCC Dig Tech Papers"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373442"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2005.1568618"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373447"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373441"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.859881"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2003.1234260"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2004.1332635"}],"event":{"name":"2008 IEEE International Solid-State Circuits Conference","start":{"date-parts":[[2008,2,3]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2008,2,7]]}},"container-title":["2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4497158\/4523032\/04523175.pdf?arnumber=4523175","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,6,4]],"date-time":"2021-06-04T20:12:30Z","timestamp":1622837550000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/4523175\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,2]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/isscc.2008.4523175","relation":{},"subject":[],"published":{"date-parts":[[2008,2]]}}}