{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T21:01:18Z","timestamp":1725656478463},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,2]]},"DOI":"10.1109\/isscc.2009.4977354","type":"proceedings-article","created":{"date-parts":[[2009,6,3]],"date-time":"2009-06-03T13:51:36Z","timestamp":1244037096000},"page":"154-155,155a","source":"Crossref","is-referenced-by-count":3,"title":["A 212MPixels\/s 4096×2160p multiview video encoder chip for 3D\/quad HDTV applications"],"prefix":"10.1109","author":[{"family":"Li-Fu Ding","sequence":"first","affiliation":[]},{"family":"Wei-Yin Chen","sequence":"additional","affiliation":[]},{"family":"Pei-Kuei Tsung","sequence":"additional","affiliation":[]},{"family":"Tzu-Der Chuang","sequence":"additional","affiliation":[]},{"family":"Hsu-Kuang Chiu","sequence":"additional","affiliation":[]},{"family":"Yu-Han Chen","sequence":"additional","affiliation":[]},{"family":"Pai-Heng Hsiao","sequence":"additional","affiliation":[]},{"family":"Shao-Yi Chien","sequence":"additional","affiliation":[]},{"family":"Tung-Chien Chen","sequence":"additional","affiliation":[]},{"family":"Ping-Chih Lin","sequence":"additional","affiliation":[]},{"family":"Chia-Yu Chang","sequence":"additional","affiliation":[]},{"family":"Liang-Gee Chen","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373403"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2005.1493902"},{"journal-title":"ISO\/IEC JTC1\/SC29\/WG11 and ITU-T SG16 Q 6","article-title":"joint draft 7.0 on multiview video coding","year":"2008","key":"1"},{"key":"4","first-page":"314","article-title":"a 242mw 10mm2 1080p h.264\/avc high-profile encoder chip","author":"lin","year":"2008","journal-title":"ISSCC Dig Tech Papers"}],"event":{"name":"2009 IEEE International Solid-State Circuits Conference (ISSCC 2009)","start":{"date-parts":[[2009,2,8]]},"location":"San Francisco, CA","end":{"date-parts":[[2009,2,12]]}},"container-title":["2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4926119\/4977283\/04977354.pdf?arnumber=4977354","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T12:24:33Z","timestamp":1489753473000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4977354\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,2]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/isscc.2009.4977354","relation":{},"subject":[],"published":{"date-parts":[[2009,2]]}}}