{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T00:26:48Z","timestamp":1725496008213},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,2]]},"DOI":"10.1109\/isscc.2010.5434011","type":"proceedings-article","created":{"date-parts":[[2010,3,24]],"date-time":"2010-03-24T14:35:14Z","timestamp":1269441314000},"page":"146-147","source":"Crossref","is-referenced-by-count":5,"title":["A wafer-level heterogeneous technology integration for flexible pseudo-SoC"],"prefix":"10.1109","author":[{"given":"Hiroshi","family":"Yamada","sequence":"first","affiliation":[]},{"given":"Yutaka","family":"Onozuka","sequence":"additional","affiliation":[]},{"given":"Atsuko","family":"Iida","sequence":"additional","affiliation":[]},{"given":"Kazuhiko","family":"Itaya","sequence":"additional","affiliation":[]},{"given":"Hideyuki","family":"Funaki","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","article-title":"MEMS-LSI Heterogeneous Device Integration Technology for System-on-Chip Applications","author":"yamada","year":"2009","journal-title":"5th International Nanotechnology Conference on Communication and Cooperation"},{"key":"ref3","first-page":"583","article-title":"Highly Integrated MEMS-Pseudo-SOC Technology-A Wafer-Level System Integration Technology for MEMS-LSI Heterogeneous Devices","author":"yamada","year":"2009","journal-title":"ICEP2009 Proceedings"},{"key":"ref6","first-page":"147","article-title":"Tunable light grating integrated with high-voltage driver IC for image projection display","author":"takahashi","year":"2007","journal-title":"Proc MEMS2000"},{"key":"ref5","first-page":"721","article-title":"Optimization of Redistribution Layers between Heterogeneous Devices for Wafer-Level Integration","author":"onozuka","year":"2008","journal-title":"Proc IMAPS 41st Int Symp Microelectron"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.5104\/jiep.11.43"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.5104\/jiep.10.42"}],"event":{"name":"2010 IEEE International Solid- State Circuits Conference - (ISSCC)","start":{"date-parts":[[2010,2,7]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2010,2,11]]}},"container-title":["2010 IEEE International Solid-State Circuits Conference - (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5428240\/5433812\/05434011.pdf?arnumber=5434011","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T19:48:06Z","timestamp":1489866486000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5434011\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,2]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc.2010.5434011","relation":{},"subject":[],"published":{"date-parts":[[2010,2]]}}}