{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,8]],"date-time":"2026-05-08T04:41:41Z","timestamp":1778215301704,"version":"3.51.4"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,2]]},"DOI":"10.1109\/isscc.2010.5434066","type":"proceedings-article","created":{"date-parts":[[2010,3,24]],"date-time":"2010-03-24T10:35:14Z","timestamp":1269426914000},"page":"9-17","source":"Crossref","is-referenced-by-count":71,"title":["MEMS for automotive and consumer electronics"],"prefix":"10.1109","author":[{"given":"Jiri","family":"Marek","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.4271\/950537"},{"key":"ref11","first-page":"847","article-title":"A precision yaw rate sensor in silicon micromachining","author":"lutz","year":"0","journal-title":"Proceedings of Transducers '97"},{"key":"ref12","first-page":"184","article-title":"New Surface Micromachined Angular Rate Sensor for Vehicle Stabilizing Systems in Automotive Applications","author":"g\u00f3mez","year":"0","journal-title":"Proceedings of Transducers '05"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/SENSOR.1995.717293"},{"key":"ref14","year":"0","journal-title":"IEEE Standard Specification Format Guide and Test Procedure for Single-Axis Interferometric Fiber Optic Gyros"},{"key":"ref15","year":"0","journal-title":"EC Proposal for Tyres in Type-approval Requirements for the General Safety of Motor Vehicles COD 2008\/100"},{"key":"ref16","year":"0","journal-title":"49 CFR Part 571 Docket No NHTSA 2000–8572] RIN 2127-A133 Federal Motor Vehicle Safety Standards Tire Pressure Monitoring Systems Controls and Displays"},{"key":"ref17","year":"0","journal-title":"Implementation of the Tread Act"},{"key":"ref4","article-title":"Global MEMS Market Suffers First-Ever Decline in 2008","year":"2009"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1982.12331"},{"key":"ref6","article-title":"Silicon Pressure Sensor with Integrated CMOS Signal Conditioning Circuit and Compensation of Temperature Coefficient","volume":"25","author":"kress","year":"1991","journal-title":"Sensors and Actuators A"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/SENSOR.2003.1215299"},{"key":"ref8","article-title":"SAE Convergence 2004","author":"liebemann","year":"2004"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/0167-577X(84)90086-7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/scientificamerican0483-44"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1967.15912"},{"key":"ref9","year":"0","journal-title":"Electronic Stability Control (ESC) and Electronic Stability Program (ESP) automotive applications"}],"event":{"name":"2010 IEEE International Solid- State Circuits Conference - (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2010,2,7]]},"end":{"date-parts":[[2010,2,11]]}},"container-title":["2010 IEEE International Solid-State Circuits Conference - (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5428240\/5433812\/05434066.pdf?arnumber=5434066","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T15:30:28Z","timestamp":1489851028000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5434066\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,2]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/isscc.2010.5434066","relation":{},"subject":[],"published":{"date-parts":[[2010,2]]}}}