{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,18]],"date-time":"2025-05-18T09:20:50Z","timestamp":1747560050867},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,2]]},"DOI":"10.1109\/isscc.2013.6487655","type":"proceedings-article","created":{"date-parts":[[2013,4,5]],"date-time":"2013-04-05T20:58:31Z","timestamp":1365195511000},"page":"102-103","source":"Crossref","is-referenced-by-count":2,"title":["Through-silicon-via-based double-side integrated microsystem for neural sensing applications"],"prefix":"10.1109","author":[{"family":"Chih-Wei Chang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Po-Tsang Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Lei-Chun Chou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Shang-Lin Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Shih-Wei Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Ching-Te Chuang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Kuan-Neng Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Jin-Chern Chiou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Wei Hwang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yen-Chi Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Chung-Hsi Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Kuo-Hua Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Chi-Tsung Chiu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Ho-Ming Tong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2009.2013718"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177109"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2011.2177577"},{"key":"6","first-page":"428","article-title":"A wireless and batteryless 130mg 300?w 10b implantable blood-pressure-sensing microsystem for real-time genetically engineered mice monitoring","author":"peng cong","year":"2009","journal-title":"ISSCC Dig Tech Papers"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2009.2029957"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2009.2032268"}],"event":{"name":"2013 IEEE International Solid-State Circuits Conference (ISSCC 2013)","start":{"date-parts":[[2013,2,17]]},"location":"San Francisco, CA","end":{"date-parts":[[2013,2,21]]}},"container-title":["2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6480926\/6487590\/06487655.pdf?arnumber=6487655","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T18:47:16Z","timestamp":1490208436000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6487655\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,2]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc.2013.6487655","relation":{},"subject":[],"published":{"date-parts":[[2013,2]]}}}