{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T08:27:08Z","timestamp":1725784028187},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,2]]},"DOI":"10.1109\/isscc.2013.6487660","type":"proceedings-article","created":{"date-parts":[[2013,4,5]],"date-time":"2013-04-05T16:58:31Z","timestamp":1365181111000},"page":"112-113","source":"Crossref","is-referenced-by-count":17,"title":["Experimental demonstration of a fully digital capacitive sensor interface built entirely using carbon-nanotube FETs"],"prefix":"10.1109","author":[{"given":"Max","family":"Shulaker","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jelle","family":"Van Rethy","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gage","family":"Hills","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hong-Yu","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Georges","family":"Gielen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.-S. Philip","family":"Wong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Subhasish","family":"Mitra","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1021\/nl203701g"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424281"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.837247"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1021\/nl200063x"},{"key":"5","first-page":"287","article-title":"A fully-digital, 0.3v, 270nw capacitive sensor interface without external references","author":"danneels","year":"2011","journal-title":"European Solid-State Circuits Conf"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2187527"}],"event":{"name":"2013 IEEE International Solid-State Circuits Conference (ISSCC 2013)","start":{"date-parts":[[2013,2,17]]},"location":"San Francisco, CA","end":{"date-parts":[[2013,2,21]]}},"container-title":["2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6480926\/6487590\/06487660.pdf?arnumber=6487660","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,3,29]],"date-time":"2019-03-29T00:52:16Z","timestamp":1553820736000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6487660\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,2]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc.2013.6487660","relation":{},"subject":[],"published":{"date-parts":[[2013,2]]}}}