{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,24]],"date-time":"2026-04-24T14:55:52Z","timestamp":1777042552995,"version":"3.51.4"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,2]]},"DOI":"10.1109\/isscc.2014.6757365","type":"proceedings-article","created":{"date-parts":[[2014,3,7]],"date-time":"2014-03-07T22:14:09Z","timestamp":1394230449000},"page":"124-125","source":"Crossref","is-referenced-by-count":29,"title":["7.1 A 1\/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate"],"prefix":"10.1109","author":[{"given":"JungChak","family":"Ahn","sequence":"first","affiliation":[]},{"given":"Kyungho","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Yitae","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Heegeun","family":"Jeong","sequence":"additional","affiliation":[]},{"given":"Bumsuk","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Hongki","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Jongeun","family":"Park","sequence":"additional","affiliation":[]},{"given":"Taesub","family":"Jung","sequence":"additional","affiliation":[]},{"given":"Wonje","family":"Park","sequence":"additional","affiliation":[]},{"given":"Taeheon","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Eunkyung","family":"Park","sequence":"additional","affiliation":[]},{"given":"Sangjun","family":"Choi","sequence":"additional","affiliation":[]},{"given":"Gyehun","family":"Choi","sequence":"additional","affiliation":[]},{"given":"Haeyong","family":"Park","sequence":"additional","affiliation":[]},{"given":"Yujung","family":"Choi","sequence":"additional","affiliation":[]},{"given":"Seungwook","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Yunkyung","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Y. Jay","family":"Jung","sequence":"additional","affiliation":[]},{"given":"Donghyuk","family":"Park","sequence":"additional","affiliation":[]},{"given":"Seungjoo","family":"Nah","sequence":"additional","affiliation":[]},{"given":"Youngsun","family":"Oh","sequence":"additional","affiliation":[]},{"given":"Mihye","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Yooseung","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Youngwoo","family":"Chung","sequence":"additional","affiliation":[]},{"given":"Ihara","family":"Hisanori","sequence":"additional","affiliation":[]},{"given":"Joonhyuk","family":"Im","sequence":"additional","affiliation":[]},{"given":"Daniel-K J","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Byunghyun","family":"Yim","sequence":"additional","affiliation":[]},{"given":"GiDoo","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Heesang","family":"Kown","sequence":"additional","affiliation":[]},{"given":"Sungho","family":"Choi","sequence":"additional","affiliation":[]},{"given":"Jeonsook","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Dongyoung","family":"Jang","sequence":"additional","affiliation":[]},{"given":"Youngchan","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Tae Chan","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Goto","family":"Hiroshige","sequence":"additional","affiliation":[]},{"given":"Chi-Young","family":"Choi","sequence":"additional","affiliation":[]},{"given":"Duckhyung","family":"Lee","sequence":"additional","affiliation":[]},{"given":"GabSoo","family":"Han","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-TSA.2013.6545641"},{"key":"2","first-page":"410","article-title":"A 1\/2.3-inch 10.3Mpixel 50 frame\/s back-illuminated CMOS image sensor","author":"wakabayashi","year":"2010","journal-title":"ISSCC Dig Tech Papers"},{"key":"1","first-page":"1","article-title":"Advanced image sensor technology for pixel scaling down toward 1.0?m (Invited)","author":"ahn","year":"2008","journal-title":"Proc IEDM"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977296"},{"key":"6","first-page":"1","article-title":"Innovative technology elements for large and small pixel CIS devices","author":"fontaine","year":"2013","journal-title":"Proc IISW"},{"key":"5","first-page":"12","article-title":"Pixel-to-pixel isolation by deep trench technology: Application to CMOS image sensor","author":"tournier","year":"2011","journal-title":"Proc IISW"},{"key":"4","article-title":"Suppression of crosstalk by using backside deep trench isolation for 1.12?m backside illuminated CMOS image sensor","author":"kitamura","year":"2012","journal-title":"Proc IEDM"},{"key":"8","first-page":"1","article-title":"Image sensors and image quality in mobile phones","author":"alakarhu","year":"2007","journal-title":"Proc IISW"}],"event":{"name":"2014 IEEE International Solid- State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2014,2,9]]},"end":{"date-parts":[[2014,2,13]]}},"container-title":["2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6747109\/6757318\/06757365.pdf?arnumber=6757365","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T22:18:19Z","timestamp":1490307499000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6757365\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,2]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/isscc.2014.6757365","relation":{},"subject":[],"published":{"date-parts":[[2014,2]]}}}