{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T08:40:15Z","timestamp":1725698415138},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,2]]},"DOI":"10.1109\/isscc.2014.6757453","type":"proceedings-article","created":{"date-parts":[[2014,3,7]],"date-time":"2014-03-07T17:14:09Z","timestamp":1394212449000},"page":"322-323","source":"Crossref","is-referenced-by-count":4,"title":["18.7 A remotely controlled locomotive IC driven by electrolytic bubbles and wireless powering"],"prefix":"10.1109","author":[{"given":"Po-Hung","family":"Kuo","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jian-Yu","family":"Hsieh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yi-Chun","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Jie","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rong-Da","family":"Tsai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tao","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hung-Wei","family":"Chiu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shey-Shi","family":"Lu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2011.2160135"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177023"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/RBME.2011.2171182"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2010.08.026"}],"event":{"name":"2014 IEEE International Solid- State Circuits Conference (ISSCC)","start":{"date-parts":[[2014,2,9]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2014,2,13]]}},"container-title":["2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6747109\/6757318\/06757453.pdf?arnumber=6757453","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T17:55:00Z","timestamp":1490291700000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6757453\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,2]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/isscc.2014.6757453","relation":{},"subject":[],"published":{"date-parts":[[2014,2]]}}}