{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T00:04:57Z","timestamp":1725667497233},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,2]]},"DOI":"10.1109\/isscc.2014.6757459","type":"proceedings-article","created":{"date-parts":[[2014,3,7]],"date-time":"2014-03-07T22:14:09Z","timestamp":1394230449000},"page":"336-337","source":"Crossref","is-referenced-by-count":13,"title":["19.6 Hybrid storage of ReRAM\/TLC NAND Flash with RAID-5\/6 for cloud data centers"],"prefix":"10.1109","author":[{"given":"Shuhei","family":"Tanakamaru","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroki","family":"Yamazawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tsukasa","family":"Tokutomi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheyang","family":"Ning","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ken","family":"Takeuchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","first-page":"226","article-title":"Unified solid-state-storage architecture with NAND flash memory and ReRAM that tolerates 32\ufffd higher BER for big-data applications","author":"tanakamaru","year":"2013","journal-title":"ISSCC Dig Tech Papers"},{"key":"2","first-page":"894","article-title":"TLC\/MLC NAND flash mix-and-match design with exchangeable storage array","author":"hachiya","year":"2013","journal-title":"SSDM"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2012.6243826"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177078"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746283"}],"event":{"name":"2014 IEEE International Solid- State Circuits Conference (ISSCC)","start":{"date-parts":[[2014,2,9]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2014,2,13]]}},"container-title":["2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6747109\/6757318\/06757459.pdf?arnumber=6757459","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T22:00:19Z","timestamp":1490306419000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6757459\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,2]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/isscc.2014.6757459","relation":{},"subject":[],"published":{"date-parts":[[2014,2]]}}}