{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,30]],"date-time":"2025-12-30T08:55:17Z","timestamp":1767084917114},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,2]]},"DOI":"10.1109\/isscc.2015.7062936","type":"proceedings-article","created":{"date-parts":[[2015,3,20]],"date-time":"2015-03-20T13:20:29Z","timestamp":1426857629000},"page":"1-3","source":"Crossref","is-referenced-by-count":8,"title":["4.7 A 409GOPS\/W adaptive and resilient domino register file in 22nm tri-gate CMOS featuring in-situ timing margin and error detection for tolerance to within-die variation, voltage droop, temperature and aging"],"prefix":"10.1109","author":[{"given":"Jaydeep P.","family":"Kulkarni","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Carlos","family":"Tokunaga","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Paolo","family":"Aseron","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Trang","family":"Nguyen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Charles","family":"Augustine","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"James","family":"Tschanz","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vivek","family":"De","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2012.6478969"},{"key":"ref3","first-page":"112","article-title":"Tunable Replica Circuits and Adaptive Voltage-Frequency Techniques for Dynamic Voltage, Temperature, and Aging Variation Tolerance","author":"tschanz","year":"2009","journal-title":"IEEE Symp on VLSI Circuits"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757361"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2089657"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2003.1253179"}],"event":{"name":"2015 IEEE International Solid-State Circuits Conference (ISSCC)","start":{"date-parts":[[2015,2,22]]},"location":"San Francisco, CA","end":{"date-parts":[[2015,2,26]]}},"container-title":["2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7054075\/7062838\/07062936.pdf?arnumber=7062936","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,2,3]],"date-time":"2020-02-03T15:52:03Z","timestamp":1580745123000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7062936\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,2]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/isscc.2015.7062936","relation":{},"subject":[],"published":{"date-parts":[[2015,2]]}}}