{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,26]],"date-time":"2025-10-26T21:23:11Z","timestamp":1761513791835},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,1]]},"DOI":"10.1109\/isscc.2016.7417977","type":"proceedings-article","created":{"date-parts":[[2016,3,25]],"date-time":"2016-03-25T16:32:21Z","timestamp":1458923541000},"page":"202-203","source":"Crossref","is-referenced-by-count":22,"title":["11.2 3D ultrasonic fingerprint sensor-on-a-chip"],"prefix":"10.1109","author":[{"given":"Hao-Yen","family":"Tang","sequence":"first","affiliation":[]},{"given":"Yipeng","family":"Lu","sequence":"additional","affiliation":[]},{"given":"Fari","family":"Assaderagh","sequence":"additional","affiliation":[]},{"given":"Mike","family":"Daneman","sequence":"additional","affiliation":[]},{"given":"Xiaoyue","family":"Jiang","sequence":"additional","affiliation":[]},{"given":"Martin","family":"Lim","sequence":"additional","affiliation":[]},{"given":"Xi","family":"Li","sequence":"additional","affiliation":[]},{"given":"Eldwin","family":"Ng","sequence":"additional","affiliation":[]},{"given":"Utkarsh","family":"Singhal","sequence":"additional","affiliation":[]},{"given":"Julius M.","family":"Tsai","sequence":"additional","affiliation":[]},{"given":"David A.","family":"Horsley","sequence":"additional","affiliation":[]},{"given":"Bernhard E.","family":"Boser","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ULTSYM.2004.1417814"},{"key":"ref3","first-page":"1877","article-title":"Design and Fabrication of a cMUT Probe for Ultrasound I rnauinu of Hnuerurints","author":"savoia","year":"2010","journal-title":"IEEE Ultras Symp Dig"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2008.4523111"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TRANSDUCERS.2015.7181013"}],"event":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","start":{"date-parts":[[2016,1,31]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2016,2,4]]}},"container-title":["2016 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7405163\/7417881\/7417977.pdf?arnumber=7417977","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,9,29]],"date-time":"2016-09-29T19:59:39Z","timestamp":1475179179000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7417977\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,1]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/isscc.2016.7417977","relation":{},"subject":[],"published":{"date-parts":[[2016,1]]}}}