{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,14]],"date-time":"2026-02-14T02:27:52Z","timestamp":1771036072563,"version":"3.50.1"},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,1]]},"DOI":"10.1109\/isscc.2016.7417979","type":"proceedings-article","created":{"date-parts":[[2016,3,25]],"date-time":"2016-03-25T20:32:21Z","timestamp":1458937941000},"page":"206-207","source":"Crossref","is-referenced-by-count":4,"title":["11.4 1650\u00b5m2 thermal-diffusivity sensors with inaccuracies down to \u00b10.75\u00b0C in 40nm CMOS"],"prefix":"10.1109","author":[{"given":"Ugur","family":"Sonmez","sequence":"first","affiliation":[]},{"given":"Fabio","family":"Sebastiano","sequence":"additional","affiliation":[]},{"given":"Kofi A.A.","family":"Makinwa","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2015.7231257"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2035553"},{"key":"ref6","article-title":"A 2800-&#x00B5;m2 Thermal Diffusivity Temperature Sensor with VCO-Based Readout in 160-nm CMOS","author":"angevare","year":"2015","journal-title":"Proc ASSCC"},{"key":"ref5","first-page":"488","article-title":"A 4600&#x00B5;m2 1.5&#x00B0;C (30) 0.9kS\/s Thermal-Diffusivity Temperature Sensor with VCO-Based Readout","author":"quan","year":"2015","journal-title":"ISSCC Dig Tech Papers"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2011.6055368"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2012.2208669"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2396522"}],"event":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA","start":{"date-parts":[[2016,1,31]]},"end":{"date-parts":[[2016,2,4]]}},"container-title":["2016 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7405163\/7417881\/07417979.pdf?arnumber=7417979","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,9,29]],"date-time":"2016-09-29T23:59:41Z","timestamp":1475193581000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7417979\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,1]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/isscc.2016.7417979","relation":{},"subject":[],"published":{"date-parts":[[2016,1]]}}}