{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,7]],"date-time":"2026-03-07T14:02:23Z","timestamp":1772892143218,"version":"3.50.1"},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,1]]},"DOI":"10.1109\/isscc.2016.7418035","type":"proceedings-article","created":{"date-parts":[[2016,3,25]],"date-time":"2016-03-25T16:32:21Z","timestamp":1458923541000},"page":"318-319","source":"Crossref","is-referenced-by-count":21,"title":["18.3 A 1.2V 64Gb 8-channel 256GB\/s HBM DRAM with peripheral-base-die architecture and small-swing technique on heavy load interface"],"prefix":"10.1109","author":[{"given":"Jong Chern","family":"Lee","sequence":"first","affiliation":[]},{"given":"Jihwan","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Kyung Whan","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Young Jun","family":"Ku","sequence":"additional","affiliation":[]},{"given":"Dae Suk","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Chunseok","family":"Jeong","sequence":"additional","affiliation":[]},{"given":"Tae Sik","family":"Yun","sequence":"additional","affiliation":[]},{"given":"Hongjung","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Ho Sung","family":"Cho","sequence":"additional","affiliation":[]},{"given":"Yeon Ok","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Jae Hwan","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Jin Ho","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Sangmuk","family":"Oh","sequence":"additional","affiliation":[]},{"given":"Hyun Sung","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Ki Hun","family":"Kwon","sequence":"additional","affiliation":[]},{"given":"Dong Beom","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Young Jae","family":"Choi","sequence":"additional","affiliation":[]},{"given":"Jeajin","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Hyeon Gon","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Jun Hyun","family":"Chun","sequence":"additional","affiliation":[]},{"given":"Jonghoon","family":"Oh","sequence":"additional","affiliation":[]},{"given":"Seok Hee","family":"Lee","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"1","article-title":"An Exact Measurement and Repair Circuit of TSV Connections for 128GB\/s High-Bandwidth Memory(HBM) Stacked DRAM","author":"lee","year":"2014","journal-title":"IEEE Symp VLSI Circuits"},{"key":"ref3","year":"2015"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2207900"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757501"},{"key":"ref1","first-page":"48","article-title":"A283.2uW 800Mb\/s\/pin DLL-based data self-aligner for Through-Silicon-Via (TSV) interface","author":"lee","year":"2012","journal-title":"ISSCC Dig Tech Papers"}],"event":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2016,1,31]]},"end":{"date-parts":[[2016,2,4]]}},"container-title":["2016 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7405163\/7417881\/7418035.pdf?arnumber=7418035","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,9,29]],"date-time":"2016-09-29T20:07:08Z","timestamp":1475179628000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7418035\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,1]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/isscc.2016.7418035","relation":{},"subject":[],"published":{"date-parts":[[2016,1]]}}}