{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,25]],"date-time":"2026-04-25T14:42:03Z","timestamp":1777128123820,"version":"3.51.4"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,2]]},"DOI":"10.1109\/isscc.2017.7870251","type":"proceedings-article","created":{"date-parts":[[2017,3,7]],"date-time":"2017-03-07T19:34:02Z","timestamp":1488915242000},"page":"42-43","source":"Crossref","is-referenced-by-count":6,"title":["2.6 A SiGe BiCMOS E-band power amplifier with 22% PAE at 18dBm OP<inf>1dB<\/inf> and 8.5% at 6dB back-off leveraging current clamping in a common-base stage"],"prefix":"10.1109","author":[{"given":"Junlei","family":"Zhao","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Elham","family":"Rahimi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Francesco","family":"Svelto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andrea","family":"Mazzanti","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2248376"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2201275"},{"key":"ref6","first-page":"210","author":"sedra","year":"2009","journal-title":"Microelectronic Circuits"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757420"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2014.6894457"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MNET.2014.6963798"}],"event":{"name":"2017 IEEE International Solid- State Circuits Conference - (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2017,2,5]]},"end":{"date-parts":[[2017,2,9]]}},"container-title":["2017 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7866667\/7870233\/07870251.pdf?arnumber=7870251","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T10:43:38Z","timestamp":1489833818000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7870251\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,2]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc.2017.7870251","relation":{},"subject":[],"published":{"date-parts":[[2017,2]]}}}