{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,13]],"date-time":"2026-03-13T05:02:57Z","timestamp":1773378177478,"version":"3.50.1"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,2]]},"DOI":"10.1109\/isscc.2017.7870323","type":"proceedings-article","created":{"date-parts":[[2017,3,7]],"date-time":"2017-03-07T19:34:02Z","timestamp":1488915242000},"page":"186-187","source":"Crossref","is-referenced-by-count":25,"title":["10.5 A three-level single-inductor triple-output converter with an adjustable flying-capacitor technique for low output ripple and fast transient response"],"prefix":"10.1109","author":[{"given":"Li-Cheng","family":"Chu","sequence":"first","affiliation":[]},{"given":"Wen-Hau","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Xiao-Qing","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Yan-Jiun","family":"Lai","sequence":"additional","affiliation":[]},{"given":"Ke-Horng","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Chin-Long","family":"Wey","sequence":"additional","affiliation":[]},{"given":"Ying-Hsi","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Shian-Ru","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Tsung-Yen","family":"Tsai","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2471839"},{"key":"ref3","article-title":"A 50MHz 5V 3W 90% Efficiency 3-Level Buck Converter with Real-Time Calibration and Wide Output Range for Fast-DVS in 65nm CMOS","author":"liu","year":"2016","journal-title":"IEEE Symp VLSI Circuits"},{"key":"ref6","first-page":"274","article-title":"Near-Independently Regulated 5-output Single-Inductor DC-DC Buck Converter Delivering 1.2W\/mm2 In 65nm CMOS","author":"kuan","year":"2012","journal-title":"ISSCC"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757347"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7417989"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746313"}],"event":{"name":"2017 IEEE International Solid- State Circuits Conference - (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2017,2,5]]},"end":{"date-parts":[[2017,2,9]]}},"container-title":["2017 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7866667\/7870233\/07870323.pdf?arnumber=7870323","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T10:48:06Z","timestamp":1489834086000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7870323\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,2]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc.2017.7870323","relation":{},"subject":[],"published":{"date-parts":[[2017,2]]}}}