{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,29]],"date-time":"2025-12-29T04:46:05Z","timestamp":1766983565524},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,2]]},"DOI":"10.1109\/isscc.2017.7870378","type":"proceedings-article","created":{"date-parts":[[2017,3,7]],"date-time":"2017-03-07T19:34:02Z","timestamp":1488915242000},"page":"296-297","source":"Crossref","is-referenced-by-count":24,"title":["17.3 A 60GHz on-chip linear radiator with single-element 27.9dBm P<inf>sat<\/inf> and 33.1dBm peak EIRP using multifeed antenna for direct on-antenna power combining"],"prefix":"10.1109","author":[{"given":"Taiyun","family":"Chi","sequence":"first","affiliation":[]},{"given":"Fei","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Sensen","family":"Li","sequence":"additional","affiliation":[]},{"given":"Min-Yu","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Jong Seok","family":"Park","sequence":"additional","affiliation":[]},{"given":"Hua","family":"Wang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2014.2379277"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2014.2387055"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2288230"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.1965.1138531"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2544784"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/APS.2016.7696501"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2014.6942050"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7418048"}],"event":{"name":"2017 IEEE International Solid- State Circuits Conference - (ISSCC)","start":{"date-parts":[[2017,2,5]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2017,2,9]]}},"container-title":["2017 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7866667\/7870233\/07870378.pdf?arnumber=7870378","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T10:39:57Z","timestamp":1489833597000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7870378\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,2]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/isscc.2017.7870378","relation":{},"subject":[],"published":{"date-parts":[[2017,2]]}}}