{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T15:00:43Z","timestamp":1725721243486},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2017,2,1]],"date-time":"2017-02-01T00:00:00Z","timestamp":1485907200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2017,2,1]],"date-time":"2017-02-01T00:00:00Z","timestamp":1485907200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,2]]},"DOI":"10.1109\/isscc.2017.7870479","type":"proceedings-article","created":{"date-parts":[[2017,3,7]],"date-time":"2017-03-07T19:34:02Z","timestamp":1488915242000},"page":"500-502","source":"Crossref","is-referenced-by-count":0,"title":["F1: Integrated voltage regulators for SoC and emerging IoT systems"],"prefix":"10.1109","author":[{"given":"Makoto","family":"Takamiya","sequence":"first","affiliation":[{"name":"University of Tokyo, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yogesh K.","family":"Ramadass","sequence":"additional","affiliation":[{"name":"Texas Instruments, San Jose, CA, United States of America"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Keith","family":"Bowman","sequence":"additional","affiliation":[{"name":"Qualcomm, Raleigh, NC, United States of America"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gerard Villar","family":"Pique","sequence":"additional","affiliation":[{"name":"NXP Semiconductors, Eindhoven, The Netherlands"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shuichi","family":"Nagai","sequence":"additional","affiliation":[{"name":"Panasonic, Osaka, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dennis","family":"Sylvester","sequence":"additional","affiliation":[{"name":"University of Michigan, Ann Arbor, United States of America"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"2017 IEEE International Solid- State Circuits Conference - (ISSCC)","start":{"date-parts":[[2017,2,5]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2017,2,9]]}},"container-title":["2017 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7866667\/7870233\/07870479.pdf?arnumber=7870479","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,29]],"date-time":"2024-02-29T18:52:58Z","timestamp":1709232778000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7870479\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,2]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/isscc.2017.7870479","relation":{},"subject":[],"published":{"date-parts":[[2017,2]]}}}