{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,6]],"date-time":"2026-03-06T23:31:46Z","timestamp":1772839906226,"version":"3.50.1"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,2]]},"DOI":"10.1109\/isscc.2018.8310312","type":"proceedings-article","created":{"date-parts":[[2018,3,16]],"date-time":"2018-03-16T15:53:18Z","timestamp":1521215598000},"page":"318-320","source":"Crossref","is-referenced-by-count":57,"title":["An 8b subthreshold hybrid thermal sensor with \u00b11.07\u00b0C inaccuracy and single-element remote-sensing technique in 22nm FinFET"],"prefix":"10.1109","author":[{"given":"Cho-Ying","family":"Lu","sequence":"first","affiliation":[]},{"given":"Surej","family":"Ravikumar","sequence":"additional","affiliation":[]},{"given":"Amruta D.","family":"Sali","sequence":"additional","affiliation":[]},{"given":"Matthias","family":"Eberlein","sequence":"additional","affiliation":[]},{"given":"Hyung-Jin","family":"Lee","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2396522"},{"key":"ref3","first-page":"271","article-title":"A Temperature Sensor with a 3 Sigma Inaccuracy of &#x00B1;2&#x00B0;C Without Trimming from-50&#x00B0;C to 150&#x00B0;C in a 16nm FinFET Process","author":"chuang","year":"2015","journal-title":"ESSCIRC"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268475"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2016.7573532"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2010.2040730"},{"key":"ref7","article-title":"Current-mode digital temperature sensor apparatus","author":"eberlein","year":"2017","journal-title":"Patent # US9557226 B2 issued"},{"key":"ref2","first-page":"162","article-title":"A BJT-Based Temperature Sensor with a Packaging Robust Inaccuracy of &#x00B1;0. 3&#x00B0;C (30) from-55&#x00B0;C to +125&#x00B0;C After Heater-Assisted Voltage Calibration","author":"yousefzadeh","year":"2017","journal-title":"ISSCC"},{"key":"ref1","first-page":"102","article-title":"An 18. 75?W Dynamic-Distributing-Bias Temperature Sensor with 0. 87&#x00B0;C (3?) Untrimmed Inaccuracy and 0. 00946mm2 Area","author":"hsu","year":"2017","journal-title":"ISSCC"}],"event":{"name":"2018 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA","start":{"date-parts":[[2018,2,11]]},"end":{"date-parts":[[2018,2,15]]}},"container-title":["2018 IEEE International Solid - State Circuits Conference - (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8304413\/8310156\/08310312.pdf?arnumber=8310312","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,4,18]],"date-time":"2018-04-18T21:58:34Z","timestamp":1524088714000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8310312\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,2]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/isscc.2018.8310312","relation":{},"subject":[],"published":{"date-parts":[[2018,2]]}}}