{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,31]],"date-time":"2026-01-31T08:18:30Z","timestamp":1769847510781,"version":"3.49.0"},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,2]]},"DOI":"10.1109\/isscc.2018.8310329","type":"proceedings-article","created":{"date-parts":[[2018,3,16]],"date-time":"2018-03-16T11:53:18Z","timestamp":1521201198000},"page":"352-354","source":"Crossref","is-referenced-by-count":12,"title":["A 286F<sup>2<\/sup>\/cell distributed bulk-current sensor and secure flush code eraser against laser fault injection attack"],"prefix":"10.1109","author":[{"given":"Kohei","family":"Matsuda","sequence":"first","affiliation":[]},{"given":"Tatsuya","family":"Fujii","sequence":"additional","affiliation":[]},{"given":"Natsu","family":"Shoji","sequence":"additional","affiliation":[]},{"given":"Takeshi","family":"Sugawara","sequence":"additional","affiliation":[]},{"given":"Kazuo","family":"Sakiyama","sequence":"additional","affiliation":[]},{"given":"Yu-ichi","family":"Hayashi","sequence":"additional","affiliation":[]},{"given":"Makoto","family":"Nagata","sequence":"additional","affiliation":[]},{"given":"Noriyuki","family":"Miura","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"1","article-title":"On-Chlp Substrate-Bounce Monitoring for Laser-Fault Countermeasure","author":"matsuda","year":"2016","journal-title":"Hardware-Oriented Security and Trust (AsianH OST) IEEE Asian"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2006.103"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746316"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2011.2174984"}],"event":{"name":"2018 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA","start":{"date-parts":[[2018,2,11]]},"end":{"date-parts":[[2018,2,15]]}},"container-title":["2018 IEEE International Solid - State Circuits Conference - (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8304413\/8310156\/08310329.pdf?arnumber=8310329","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,4,18]],"date-time":"2018-04-18T17:58:58Z","timestamp":1524074338000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8310329\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,2]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/isscc.2018.8310329","relation":{},"subject":[],"published":{"date-parts":[[2018,2]]}}}