{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T08:10:17Z","timestamp":1725783017888},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,2]]},"DOI":"10.1109\/isscc.2018.8310384","type":"proceedings-article","created":{"date-parts":[[2018,3,16]],"date-time":"2018-03-16T11:53:18Z","timestamp":1521201198000},"page":"462-464","source":"Crossref","is-referenced-by-count":7,"title":["A fully immersible deep-brain neural probe with modular architecture and a delta-sigma ADC integrated under each electrode for parallel readout of 144 recording sites"],"prefix":"10.1109","author":[{"given":"Daniel","family":"De Dorigo","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Christian","family":"Moranz","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hagen","family":"Graf","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Maximilian","family":"Marx","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Boyu","family":"Shui","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Matthias","family":"Kuhl","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yiannos","family":"Manoli","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"392","article-title":"A 966-Electrode Neural Probe with 384 Configurable Channels in 0. 13?m SOI CMOS","author":"lopez","year":"2016","journal-title":"ISSCC Dig Tech Papers"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/ESSDERC.2016.7599667"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1039\/C5TB00108K"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/TRANSDUCERS.2017.7993977"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1109\/TBME.2015.2406113"}],"event":{"name":"2018 IEEE International Solid-State Circuits Conference (ISSCC)","start":{"date-parts":[[2018,2,11]]},"location":"San Francisco, CA","end":{"date-parts":[[2018,2,15]]}},"container-title":["2018 IEEE International Solid - State Circuits Conference - (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8304413\/8310156\/08310384.pdf?arnumber=8310384","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,4,11]],"date-time":"2018-04-11T17:39:58Z","timestamp":1523468398000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8310384\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,2]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/isscc.2018.8310384","relation":{},"subject":[],"published":{"date-parts":[[2018,2]]}}}