{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,1]],"date-time":"2025-11-01T15:51:07Z","timestamp":1762012267619,"version":"build-2065373602"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,2,1]],"date-time":"2019-02-01T00:00:00Z","timestamp":1548979200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,2,1]],"date-time":"2019-02-01T00:00:00Z","timestamp":1548979200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,2,1]],"date-time":"2019-02-01T00:00:00Z","timestamp":1548979200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,2]]},"DOI":"10.1109\/isscc.2019.8662429","type":"proceedings-article","created":{"date-parts":[[2019,3,18]],"date-time":"2019-03-18T23:16:55Z","timestamp":1552951015000},"page":"478-480","source":"Crossref","is-referenced-by-count":10,"title":["30.3 A 25.6Gb\/s Uplink-Downlink Interface Employing PAM-4-Based 4-Channel Multiplexing and Cascaded CDR Circuits in Ring Topology for High-Bandwidth and Large-Capacity Storage Systems"],"prefix":"10.1109","author":[{"given":"Takashi","family":"Toi","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Junji","family":"Wadatsumi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroyuki","family":"Kobayashi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yutaka","family":"Shimizu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuji","family":"Satoh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Makoto","family":"Morimoto","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rui","family":"Ito","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mitsuyuki","family":"Ashida","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuta","family":"Tsubouchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mai","family":"Nozawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Go","family":"Urakawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Deguchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"118","article-title":"A 1.8pJ\/b 56Gb\/s PAM-4 Transmitter with Fractionally Spaced FFE in 14nm CMOS","author":"dickson","year":"2017","journal-title":"ISSCC"},{"key":"ref3","first-page":"58","article-title":"A 36Gb\/s PAM4 Transmitter Using an 8b 18GS\/s DAC in 28nm CMOS","author":"nazemi","year":"2015","journal-title":"ISSCC"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870287"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2017.8240221"},{"key":"ref2","first-page":"149","article-title":"A 12.8 Gb\/s Daisy Chain-Based Downlink I\/F Employing Spectrally Compressed Multi-Band Multiplexing for High-Bandwidth and Large-Capacity Storage Systems","author":"tsubouchi","year":"2018","journal-title":"IEEE Symp VLSI Circuits"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.3389\/fnana.2016.00062"}],"event":{"name":"2019 IEEE International Solid- State Circuits Conference - (ISSCC)","start":{"date-parts":[[2019,2,17]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2019,2,21]]}},"container-title":["2019 IEEE International Solid- State Circuits Conference - (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8656625\/8662285\/08662429.pdf?arnumber=8662429","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,19]],"date-time":"2022-07-19T20:23:06Z","timestamp":1658262186000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8662429\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,2]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc.2019.8662429","relation":{},"subject":[],"published":{"date-parts":[[2019,2]]}}}