{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,28]],"date-time":"2026-03-28T17:06:45Z","timestamp":1774717605419,"version":"3.50.1"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,2,1]],"date-time":"2019-02-01T00:00:00Z","timestamp":1548979200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,2,1]],"date-time":"2019-02-01T00:00:00Z","timestamp":1548979200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,2,1]],"date-time":"2019-02-01T00:00:00Z","timestamp":1548979200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,2]]},"DOI":"10.1109\/isscc.2019.8662538","type":"proceedings-article","created":{"date-parts":[[2019,3,18]],"date-time":"2019-03-18T23:16:55Z","timestamp":1552951015000},"page":"308-310","source":"Crossref","is-referenced-by-count":15,"title":["18.8 A 192pW Hybrid Bandgap-V<inf>th<\/inf> Reference with Process Dependence Compensated by a Dimension-Induced Side-Effect"],"prefix":"10.1109","author":[{"given":"Youngwoo","family":"Ji","sequence":"first","affiliation":[]},{"given":"Jungho","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Byungsub","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Hong-June","family":"Park","sequence":"additional","affiliation":[]},{"given":"Jae-Yoon","family":"Sim","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2654326"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870280"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2206683"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2016.7573494"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7062945"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2017.8008463"}],"event":{"name":"2019 IEEE International Solid- State Circuits Conference - (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2019,2,17]]},"end":{"date-parts":[[2019,2,21]]}},"container-title":["2019 IEEE International Solid- State Circuits Conference - (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8656625\/8662285\/08662538.pdf?arnumber=8662538","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,19]],"date-time":"2022-07-19T20:21:47Z","timestamp":1658262107000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8662538\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,2]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc.2019.8662538","relation":{},"subject":[],"published":{"date-parts":[[2019,2]]}}}