{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T17:25:52Z","timestamp":1772645152888,"version":"3.50.1"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,2,13]]},"DOI":"10.1109\/isscc42613.2021.9365752","type":"proceedings-article","created":{"date-parts":[[2021,3,3]],"date-time":"2021-03-03T21:23:11Z","timestamp":1614806591000},"page":"180-182","source":"Crossref","is-referenced-by-count":32,"title":["11.1 A 1.7pJ\/b 112Gb\/s XSR Transceiver for Intra-Package Communication in 7nm FinFET Technology"],"prefix":"10.1109","author":[{"given":"Ramy","family":"Yousry","sequence":"first","affiliation":[]},{"given":"Ehung","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Yu-Ming","family":"Ying","sequence":"additional","affiliation":[]},{"given":"Mohammed","family":"Abdullatif","sequence":"additional","affiliation":[]},{"given":"Mohammad","family":"Elbadry","sequence":"additional","affiliation":[]},{"given":"Ahmed","family":"ElShater","sequence":"additional","affiliation":[]},{"given":"Tsz-Bin","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Joonyeong","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Dhinessh","family":"Ramachandran","sequence":"additional","affiliation":[]},{"given":"Kaiz","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Chih-Hao","family":"Weng","sequence":"additional","affiliation":[]},{"given":"Mau-Lin","family":"Wu","sequence":"additional","affiliation":[]},{"given":"Tamer","family":"Ali","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2019.8780221"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSICircuits18222.2020.9162821"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310205"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662495"},{"key":"ref2","first-page":"1","article-title":"A 40-Gb\/s serial link transceiver in 28-nm CMOS technology","author":"chen","year":"2014","journal-title":"IEEE Symp VLSI Circuits"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062925"}],"event":{"name":"2021 IEEE International Solid- State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2021,2,13]]},"end":{"date-parts":[[2021,2,22]]}},"container-title":["2021 IEEE International Solid- State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9365732\/9365735\/09365752.pdf?arnumber=9365752","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T15:42:07Z","timestamp":1652197327000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9365752\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,2,13]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc42613.2021.9365752","relation":{},"subject":[],"published":{"date-parts":[[2021,2,13]]}}}