{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,28]],"date-time":"2026-03-28T16:45:35Z","timestamp":1774716335252,"version":"3.50.1"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100010450","name":"Nova","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100010450","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,2,13]]},"DOI":"10.1109\/isscc42613.2021.9365984","type":"proceedings-article","created":{"date-parts":[[2021,3,3]],"date-time":"2021-03-03T16:23:11Z","timestamp":1614788591000},"page":"250-252","source":"Crossref","is-referenced-by-count":157,"title":["16.3 A 28nm 384kb 6T-SRAM Computation-in-Memory Macro with 8b Precision for AI Edge Chips"],"prefix":"10.1109","author":[{"given":"Jian-Wei","family":"Su","sequence":"first","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Yen-Chi","family":"Chou","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Ruhui","family":"Liu","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Ta-Wei","family":"Liu","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Pei-Jung","family":"Lu","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Ping-Chun","family":"Wu","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Yen-Lin","family":"Chung","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Li-Yang","family":"Hung","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Jin-Sheng","family":"Ren","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Tianlong","family":"Pan","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Sih-Han","family":"Li","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute,Hsinchu,Taiwan"}]},{"given":"Shih-Chieh","family":"Chang","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute,Hsinchu,Taiwan"}]},{"given":"Shyh-Shyuan","family":"Sheu","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute,Hsinchu,Taiwan"}]},{"given":"Wei-Chung","family":"Lo","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute,Hsinchu,Taiwan"}]},{"given":"Chih-I","family":"Wu","sequence":"additional","affiliation":[{"name":"Industrial Technology Research Institute,Hsinchu,Taiwan"}]},{"given":"Xin","family":"Si","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Chung-Chuan","family":"Lo","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Ren-Shuo","family":"Liu","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Chih-Cheng","family":"Hsieh","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Kea-Tiong","family":"Tang","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]},{"given":"Meng-Fan","family":"Chang","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062995"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662392"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062949"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062985"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662435"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310397"}],"event":{"name":"2021 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2021,2,13]]},"end":{"date-parts":[[2021,2,22]]}},"container-title":["2021 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9365732\/9365735\/09365984.pdf?arnumber=9365984","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,26]],"date-time":"2025-08-26T19:09:59Z","timestamp":1756235399000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9365984\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,2,13]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc42613.2021.9365984","relation":{},"subject":[],"published":{"date-parts":[[2021,2,13]]}}}