{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,1,18]],"date-time":"2025-01-18T05:21:51Z","timestamp":1737177711689,"version":"3.33.0"},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-009"},{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-001"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,2,13]]},"DOI":"10.1109\/isscc42613.2021.9366007","type":"proceedings-article","created":{"date-parts":[[2021,3,3]],"date-time":"2021-03-03T21:23:11Z","timestamp":1614806591000},"page":"537-538","source":"Crossref","is-referenced-by-count":0,"title":["SE1: What Technologies Will Shape the Future of Computing?"],"prefix":"10.1109","author":[{"given":"Hugh","family":"Mair","sequence":"first","affiliation":[{"name":"MediaTek,Austin,TX"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shinichiro","family":"Shiratake","sequence":"additional","affiliation":[{"name":"Kioxia,Yokohama,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eric","family":"Karl","sequence":"additional","affiliation":[{"name":"Intel,Hillsboro,OR"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thomas","family":"Burd","sequence":"additional","affiliation":[{"name":"AMD,Santa Clara,CA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jonathan","family":"Chang","sequence":"additional","affiliation":[{"name":"TSMC,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Debbie","family":"Marr","sequence":"additional","affiliation":[{"name":"Intel,Hillsboro,OR"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Samuel","family":"Naffziger","sequence":"additional","affiliation":[{"name":"AMD,Fort Collins"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Henk","family":"Corporaal","sequence":"additional","affiliation":[{"name":"Eindhoven University,The Netherlands"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ken","family":"Takeuchi","sequence":"additional","affiliation":[{"name":"University of Tokyo,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Naresh","family":"Shanbhag","sequence":"additional","affiliation":[{"name":"University of Illinois,Urbana-Champaign,IL"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"2021 IEEE International Solid-State Circuits Conference (ISSCC)","start":{"date-parts":[[2021,2,13]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2021,2,22]]}},"container-title":["2021 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9365732\/9365735\/09366007.pdf?arnumber=9366007","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,17]],"date-time":"2025-01-17T18:34:12Z","timestamp":1737138852000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9366007\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,2,13]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/isscc42613.2021.9366007","relation":{},"subject":[],"published":{"date-parts":[[2021,2,13]]}}}