{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,4]],"date-time":"2026-05-04T19:02:19Z","timestamp":1777921339721,"version":"3.51.4"},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-009"},{"start":{"date-parts":[[2021,2,13]],"date-time":"2021-02-13T00:00:00Z","timestamp":1613174400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-001"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,2,13]]},"DOI":"10.1109\/isscc42613.2021.9366040","type":"proceedings-article","created":{"date-parts":[[2021,3,3]],"date-time":"2021-03-03T16:23:11Z","timestamp":1614788591000},"page":"520-524","source":"Crossref","is-referenced-by-count":0,"title":["F3: Silicon Technologies in the Fight Against Pandemics - From Point of Care to Computational Epidemiology"],"prefix":"10.1109","author":[{"given":"Nick","family":"Van Helleputte","sequence":"first","affiliation":[{"name":"imec,Leuven,Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Arijit","family":"Raychowdhury","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology,Atlanta,GA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ping-Hsuan","family":"Hsieh","sequence":"additional","affiliation":[{"name":"National Tsing Hua University,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Deguchi","sequence":"additional","affiliation":[{"name":"Kioxia,Kawasaki,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Matteo","family":"Perenzoni","sequence":"additional","affiliation":[{"name":"Fondazione Bruno Kessler,Trento,Italy"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Esther","family":"Rodriguez-Villegas","sequence":"additional","affiliation":[{"name":"Imperial College London,London,United Kingdom"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Long","family":"Yan","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andreia","family":"Cathelin","sequence":"additional","affiliation":[{"name":"STMicroelectronics,Crolles,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Keith","family":"Bowman","sequence":"additional","affiliation":[{"name":"Qualcomm,Raleigh,NC"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chris","family":"Van Hoof","sequence":"additional","affiliation":[{"name":"imec,Leuven,Belgium"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"2021 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2021,2,13]]},"end":{"date-parts":[[2021,2,22]]}},"container-title":["2021 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9365732\/9365735\/09366040.pdf?arnumber=9366040","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T19:52:08Z","timestamp":1777665128000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9366040\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,2,13]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/isscc42613.2021.9366040","relation":{},"subject":[],"published":{"date-parts":[[2021,2,13]]}}}