{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,4]],"date-time":"2026-03-04T17:04:21Z","timestamp":1772643861648,"version":"3.50.1"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,2,20]],"date-time":"2022-02-20T00:00:00Z","timestamp":1645315200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,2,20]],"date-time":"2022-02-20T00:00:00Z","timestamp":1645315200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,2,20]]},"DOI":"10.1109\/isscc42614.2022.9731655","type":"proceedings-article","created":{"date-parts":[[2022,3,17]],"date-time":"2022-03-17T20:48:08Z","timestamp":1647550088000},"page":"1-3","source":"Crossref","is-referenced-by-count":19,"title":["2-Tx Digital Envelope-Tracking Supply Modulator Achieving 200MHz Channel Bandwidth and 93.6% Efficiency for 2G\/3G\/LTE\/NR RF Power Amplifiers"],"prefix":"10.1109","author":[{"given":"Jun-Suk","family":"Bang","sequence":"first","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Dongsu","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Jeongkwang","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Sungyoub","family":"Jung","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Younghwan","family":"Choo","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Seungchan","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Young-Ho","family":"Jung","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Jae-Young","family":"Ko","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Takahiro","family":"Nomiyama","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Jongbeom","family":"Baek","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Jaeyeol","family":"Han","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Sang-Han","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Ik-Hwan","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Ji-Seon","family":"Paek","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Jongwoo","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]},{"given":"Thomas Byunghak","family":"Cho","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Hwaseong,Korea"}]}],"member":"263","reference":[{"key":"ref4","first-page":"238","article-title":"An 88%-Efficiency Supply Modulator Achieving 1.08?s\/V Fast Transition and 100MHz Envelope-Tracking Bandwidth for 5G New Radio RF Power Amplifier","author":"paek","year":"2019","journal-title":"ISSCC"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365986"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063105"},{"key":"ref5","first-page":"432","article-title":"An 87.1 % Efficiency RF-PA Envelope-Tracking Modulator for 80MHz LTE-Advanced Transmitter and 31 dBm PA Output Power for HPUE in 0.153?m CMOS","author":"ho","year":"2018","journal-title":"ISSCC"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8059042"},{"key":"ref1","year":"2020","journal-title":"Technical Specification 5G NR User Equipment (UE) Radio Transmission and Reception Part 1 Range 1 Standalone (3GPP TS 38 101–1 version 16 5 0 Release 16)"}],"event":{"name":"2022 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2022,2,20]]},"end":{"date-parts":[[2022,2,26]]}},"container-title":["2022 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9731529\/9731102\/09731655.pdf?arnumber=9731655","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,10,23]],"date-time":"2023-10-23T17:57:50Z","timestamp":1698083870000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9731655\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,2,20]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc42614.2022.9731655","relation":{},"subject":[],"published":{"date-parts":[[2022,2,20]]}}}