{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,16]],"date-time":"2026-06-16T15:10:58Z","timestamp":1781622658116,"version":"3.54.5"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,2,20]],"date-time":"2022-02-20T00:00:00Z","timestamp":1645315200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,2,20]],"date-time":"2022-02-20T00:00:00Z","timestamp":1645315200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key R&D Program","doi-asserted-by":"publisher","award":["2018YFA0701500"],"award-info":[{"award-number":["2018YFA0701500"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["61974033,61732020,61821091"],"award-info":[{"award-number":["61974033,61732020,61821091"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100006296","name":"CAS","doi-asserted-by":"publisher","award":["XDB44000000"],"award-info":[{"award-number":["XDB44000000"]}],"id":[{"id":"10.13039\/100006296","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,2,20]]},"DOI":"10.1109\/isscc42614.2022.9731657","type":"proceedings-article","created":{"date-parts":[[2022,3,17]],"date-time":"2022-03-17T20:48:08Z","timestamp":1647550088000},"page":"1-3","source":"Crossref","is-referenced-by-count":49,"title":["COMB-MCM: Computing-on-Memory-Boundary NN Processor with Bipolar Bitwise Sparsity Optimization for Scalable Multi-Chiplet-Module Edge Machine Learning"],"prefix":"10.1109","author":[{"given":"Haozhe","family":"Zhu","sequence":"first","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bo","family":"Jiao","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jinshan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xinru","family":"Jia","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yunzhengmao","family":"Wang","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tianchan","family":"Guan","sequence":"additional","affiliation":[{"name":"Alibaba DAMO Academy,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shengcheng","family":"Wang","sequence":"additional","affiliation":[{"name":"Alibaba DAMO Academy,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dimin","family":"Niu","sequence":"additional","affiliation":[{"name":"Alibaba DAMO Academy,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hongzhong","family":"Zheng","sequence":"additional","affiliation":[{"name":"Alibaba DAMO Academy,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chixiao","family":"Chen","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mingyu","family":"Wang","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lihua","family":"Zhang","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaoyang","family":"Zeng","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qi","family":"Liu","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuan","family":"Xie","sequence":"additional","affiliation":[{"name":"Alibaba DAMO Academy,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ming","family":"Liu","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","first-page":"238","article-title":"A 2.75-to-75.9TOPS\/W CIM NN Processor Supporting Set-Associate Block-Wise Zero Skipping and Ping-Pong CIM","author":"Yue","year":"2021","journal-title":"ISSCC"},{"key":"ref2","article-title":"A 6.54-to-26.03 TOPS\/W CIM RNN Processor using Input Similarity Optimization and Attention-based Context-breaking with Output Speculation","volume-title":"IEEE Symp. VLSI Circuits","author":"Guo","year":"2021"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365788"},{"issue":"4","key":"ref4","first-page":"920","article-title":"A 0.32\u2013128 TOPS, Scalable MCMBased Deep Neural Network Inference Accelerator with Ground-Referenced Signaling in 16 nm","volume":"55","author":"Zimmer","year":"2020","journal-title":"IEEE JSSC"},{"key":"ref5","first-page":"252","article-title":"An 89TOPS\/W and 16.3TOPS\/mm2 AllDigital SRAM-Based FulI-Precision CIM Macro in 22nm for Machine-Learning Edge Applications","author":"Chih","year":"2021","journal-title":"ISSCC"},{"key":"ref6","first-page":"240","article-title":"A 65nm 3T Dynamic Analog RAM Based CIM Macro and CNN Accelerator with Retention Enhancement, Adaptive Analog Sparsity and 44TOPS\/W System Energy Efficiency","author":"Chen","year":"2021","journal-title":"ISSCC"}],"event":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2022,2,20]]},"end":{"date-parts":[[2022,2,26]]}},"container-title":["2022 IEEE International Solid- State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9731529\/9731102\/09731657.pdf?arnumber=9731657","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T01:50:26Z","timestamp":1706061026000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9731657\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,2,20]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc42614.2022.9731657","relation":{},"subject":[],"published":{"date-parts":[[2022,2,20]]}}}