{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,30]],"date-time":"2025-12-30T08:53:20Z","timestamp":1767084800043,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,2,20]],"date-time":"2022-02-20T00:00:00Z","timestamp":1645315200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,2,20]],"date-time":"2022-02-20T00:00:00Z","timestamp":1645315200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,2,20]]},"DOI":"10.1109\/isscc42614.2022.9731743","type":"proceedings-article","created":{"date-parts":[[2022,3,17]],"date-time":"2022-03-17T20:48:08Z","timestamp":1647550088000},"page":"1-3","source":"Crossref","is-referenced-by-count":9,"title":["A $\\boldsymbol{210}\\times \\boldsymbol{340}\\times \\boldsymbol{50}\\boldsymbol{\\mu}\\mathbf{m}$ Integrated CMOS System f0 $\\mathbf{r}$ Micro-Robots with Energy Harvesting, Sensing, Processing, Communication and Actuation"],"prefix":"10.1109","author":[{"given":"Li","family":"Xu","sequence":"first","affiliation":[{"name":"University of Michigan,Ann Arbor,MI"}]},{"given":"Maya","family":"Lassiter","sequence":"additional","affiliation":[{"name":"University of Michigan,Ann Arbor,MI"}]},{"given":"Xiao","family":"Wu","sequence":"additional","affiliation":[{"name":"University of Michigan,Ann Arbor,MI"}]},{"given":"Yejoong","family":"Kim","sequence":"additional","affiliation":[{"name":"University of Michigan,Ann Arbor,MI"}]},{"given":"Jungho","family":"Lee","sequence":"additional","affiliation":[{"name":"University of Michigan,Ann Arbor,MI"}]},{"given":"Makoto","family":"Yasuda","sequence":"additional","affiliation":[{"name":"United Semiconductor Japan,Kuwana,Japan"}]},{"given":"Masaru","family":"Kawaminami","sequence":"additional","affiliation":[{"name":"United Semiconductor Japan,Yokohama,Japan"}]},{"given":"Marc","family":"Miskin","sequence":"additional","affiliation":[{"name":"University of Pennsylvania,Philadelphia,PA"}]},{"given":"David","family":"Blaauw","sequence":"additional","affiliation":[{"name":"University of Michigan,Ann Arbor,MI"}]},{"given":"Dennis","family":"Sylvester","sequence":"additional","affiliation":[{"name":"University of Michigan,Ann Arbor,MI"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492459"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-021-85268-5"},{"key":"ref10","first-page":"533","article-title":"To keep pace with Moore's law, chipmakers turn to chiplets","volume":"15","author":"simonite","year":"2018","journal-title":"Wired Magazine"},{"key":"ref6","first-page":"191","article-title":"A 0.04mm3 16nW Wireless and Batteryless Sensor System with Integrated Cortex-M0+ Processor and Optical Communication for Cellular Temperature Measurement","author":"wu","year":"2018","journal-title":"IEEE Symposium on VLSI Circuits Honolulu HI"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1919677117"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-020-2626-9"},{"key":"ref7","first-page":"256","article-title":"A 200?$m$ x 200?m x 100?m, 63nW, 2.4GHz injectable fully- monolithic wireless bio-sensing system","author":"o'driscoll","year":"2017","journal-title":"IEEE RFIC Symp Honolulu"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.abf6312"},{"key":"ref9","article-title":"A 380pW dual mode optical wake-up receiver with ambient noise cancellation","author":"lim","year":"2016","journal-title":"IEEE Symp VLSI Circuits"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-021-00631-8"}],"event":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","start":{"date-parts":[[2022,2,20]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2022,2,26]]}},"container-title":["2022 IEEE International Solid- State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9731529\/9731102\/09731743.pdf?arnumber=9731743","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,10]],"date-time":"2022-06-10T21:17:12Z","timestamp":1654895832000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9731743\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,2,20]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/isscc42614.2022.9731743","relation":{},"subject":[],"published":{"date-parts":[[2022,2,20]]}}}