{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,4]],"date-time":"2025-12-04T10:03:21Z","timestamp":1764842601615,"version":"3.28.0"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,2,20]],"date-time":"2022-02-20T00:00:00Z","timestamp":1645315200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,2,20]],"date-time":"2022-02-20T00:00:00Z","timestamp":1645315200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,2,20]]},"DOI":"10.1109\/isscc42614.2022.9731764","type":"proceedings-article","created":{"date-parts":[[2022,3,17]],"date-time":"2022-03-17T16:48:08Z","timestamp":1647535688000},"page":"234-236","source":"Crossref","is-referenced-by-count":18,"title":["A 2.5-5MHz 87% Peak Efficiency 48V-to-1V Integrated Hybrid DC-DC Converter Adopting Ladder SC Network with Capacitor-Assisted Dual-Inductor Filtering"],"prefix":"10.1109","author":[{"given":"Chen","family":"Chen","sequence":"first","affiliation":[{"name":"University of Texas at Dallas,Richardson,TX"}]},{"given":"Jin","family":"Liu","sequence":"additional","affiliation":[{"name":"University of Texas at Dallas,Richardson,TX"}]},{"given":"Hoi","family":"Lee","sequence":"additional","affiliation":[{"name":"University of Texas at Dallas,Richardson,TX"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063087"},{"key":"ref3","first-page":"988","article-title":"Direct 48-\/1-V GaN-Based DC-DC Power Converter with Double Step-Down Architecture and Master-Slave AO2 T Control","volume":"55","author":"yan","year":"2020","journal-title":"IEEE JSSC"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366005"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2403715"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2017.7930719"}],"event":{"name":"2022 IEEE International Solid- State Circuits Conference (ISSCC)","start":{"date-parts":[[2022,2,20]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2022,2,26]]}},"container-title":["2022 IEEE International Solid- State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9731529\/9731102\/09731764.pdf?arnumber=9731764","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,15]],"date-time":"2022-06-15T16:11:36Z","timestamp":1655309496000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9731764\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,2,20]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/isscc42614.2022.9731764","relation":{},"subject":[],"published":{"date-parts":[[2022,2,20]]}}}