{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,1]],"date-time":"2026-07-01T16:32:50Z","timestamp":1782923570349,"version":"3.54.5"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,2,19]],"date-time":"2023-02-19T00:00:00Z","timestamp":1676764800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,2,19]],"date-time":"2023-02-19T00:00:00Z","timestamp":1676764800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,2,19]]},"DOI":"10.1109\/isscc42615.2023.10067265","type":"proceedings-article","created":{"date-parts":[[2023,3,23]],"date-time":"2023-03-23T17:38:07Z","timestamp":1679593087000},"page":"236-238","source":"Crossref","is-referenced-by-count":13,"title":["15.1 A Self-Powered SoC with Distributed Cooperative Energy Harvesting and Multi-Chip Power Management for System-in-Fiber"],"prefix":"10.1109","author":[{"given":"Xinjian","family":"Liu","sequence":"first","affiliation":[{"name":"University of Virginia,Charlottesville,VA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daniel S.","family":"Truesdell","sequence":"additional","affiliation":[{"name":"University of Virginia,Charlottesville,VA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Omar","family":"Faruqe","sequence":"additional","affiliation":[{"name":"University of Virginia,Charlottesville,VA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lalitha","family":"Parameswaran","sequence":"additional","affiliation":[{"name":"MIT Lincoln Laboratory,Lexington,MA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Michael","family":"Rickley","sequence":"additional","affiliation":[{"name":"MIT Lincoln Laboratory,Lexington,MA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Andrew","family":"Kopanski","sequence":"additional","affiliation":[{"name":"MIT Lincoln Laboratory,Lexington,MA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lauren","family":"Cantley","sequence":"additional","affiliation":[{"name":"MIT Lincoln Laboratory,Lexington,MA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Austin","family":"Coon","sequence":"additional","affiliation":[{"name":"MIT Lincoln Laboratory,Lexington,MA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Matthew","family":"Bernasconi","sequence":"additional","affiliation":[{"name":"MIT Lincoln Laboratory,Lexington,MA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tairan","family":"Wang","sequence":"additional","affiliation":[{"name":"MIT Lincoln Laboratory,Lexington,MA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Benton H.","family":"Calhoun","sequence":"additional","affiliation":[{"name":"University of Virginia,Charlottesville,VA,United States"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-021-21701-7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-021-23628-5"},{"key":"ref3","first-page":"256","article-title":"A 200\u00b5m x 200\u00b5m x 100\u00b5m, 63nW, 2. 4GHz Injectable Fully-Monolithic Wireless Bio-Sensina System","author":"ODriscoll","year":"2017","journal-title":"IEEE RFIC"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2018.8502391"},{"key":"ref5","first-page":"194","article-title":"A 210 \u00d7 340 \u00d7 50j. lm Integrated CMOS System for Micro-Robots with Energy Harvesting, Sensing, Processing, Communication and Actuation","author":"Xu","year":"2022","journal-title":"ISSCC"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3141688"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830206"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731758"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3038115"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/cicc.2019.8780382"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2016.2545709"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2715827"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3048481"}],"event":{"name":"2023 IEEE International Solid- State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,2,19]]},"end":{"date-parts":[[2023,2,23]]}},"container-title":["2023 IEEE International Solid- State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10067248\/10067251\/10067265.pdf?arnumber=10067265","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,14]],"date-time":"2024-03-14T05:50:09Z","timestamp":1710395409000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10067265\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,2,19]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/isscc42615.2023.10067265","relation":{},"subject":[],"published":{"date-parts":[[2023,2,19]]}}}