{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,26]],"date-time":"2026-02-26T15:45:53Z","timestamp":1772120753439,"version":"3.50.1"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,2,19]],"date-time":"2023-02-19T00:00:00Z","timestamp":1676764800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,2,19]],"date-time":"2023-02-19T00:00:00Z","timestamp":1676764800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,2,19]]},"DOI":"10.1109\/isscc42615.2023.10067657","type":"proceedings-article","created":{"date-parts":[[2023,3,23]],"date-time":"2023-03-23T17:38:07Z","timestamp":1679593087000},"page":"5-7","source":"Crossref","is-referenced-by-count":21,"title":["6.1 A 112Gb\/s Serial Link Transceiver With 3-tap FFE and 18-tap DFE Receiver for up to 43dB Insertion Loss Channel in 7nm FinFET Technology"],"prefix":"10.1109","author":[{"given":"Bo","family":"Zhang","sequence":"first","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Anand","family":"Vasani","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Ashutosh","family":"Sinha","sequence":"additional","affiliation":[{"name":"Broadcom,San Jose,CA"}]},{"given":"Alireza","family":"Nilchi","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Haitao","family":"Tong","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Lakshmi","family":"Rao","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Karapet","family":"Khanoyan","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Hamid","family":"Hatamkhani","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Xiaochen","family":"Yang","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Xin","family":"Meng","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Alexander","family":"Wong","sequence":"additional","affiliation":[{"name":"Broadcom,San Jose,CA"}]},{"given":"Jun","family":"Kim","sequence":"additional","affiliation":[{"name":"Broadcom,San Jose,CA"}]},{"given":"Ping","family":"Jing","sequence":"additional","affiliation":[{"name":"Broadcom,San Jose,CA"}]},{"given":"Yehui","family":"Sun","sequence":"additional","affiliation":[{"name":"Broadcom,San Jose,CA"}]},{"given":"Ali","family":"Nazemi","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Dean","family":"Liu","sequence":"additional","affiliation":[{"name":"Broadcom,San Jose,CA"}]},{"given":"Anthony","family":"Brewster","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Jun","family":"Cao","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]},{"given":"Afshin","family":"Momtaz","sequence":"additional","affiliation":[{"name":"Broadcom,Irvine,CA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063081"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062925"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366030"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731650"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/49.87640"},{"key":"ref6","first-page":"120","article-title":"An 182mW 1\u201360Gbps Configurable PAM4\/NRZ Transceiver for Large Scale ASIC Integration in 7-nm FinFET Technology","author":"Kocaman","year":"2022","journal-title":"ISSCC"}],"event":{"name":"2023 IEEE International Solid- State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,2,19]]},"end":{"date-parts":[[2023,2,23]]}},"container-title":["2023 IEEE International Solid- State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10067248\/10067251\/10067657.pdf?arnumber=10067657","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,3]],"date-time":"2024-03-03T05:00:30Z","timestamp":1709442030000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10067657\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,2,19]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc42615.2023.10067657","relation":{},"subject":[],"published":{"date-parts":[[2023,2,19]]}}}