{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,26]],"date-time":"2026-06-26T22:45:29Z","timestamp":1782513929668,"version":"3.54.5"},"reference-count":28,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,2,19]],"date-time":"2023-02-19T00:00:00Z","timestamp":1676764800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,2,19]],"date-time":"2023-02-19T00:00:00Z","timestamp":1676764800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,2,19]]},"DOI":"10.1109\/isscc42615.2023.10067810","type":"proceedings-article","created":{"date-parts":[[2023,3,23]],"date-time":"2023-03-23T17:38:07Z","timestamp":1679593087000},"page":"8-12","source":"Crossref","is-referenced-by-count":31,"title":["1.1 Innovation For the Next Decade of Compute Efficiency"],"prefix":"10.1109","author":[{"given":"Lisa","family":"Su","sequence":"first","affiliation":[{"name":"AMD,Austin,TX"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sam","family":"Naffziger","sequence":"additional","affiliation":[{"name":"AMD,Fort Collins,CO"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268306"},{"key":"ref2","volume-title":"Published SPEC Benchmark Results"},{"key":"ref3","volume-title":"50 Years of Microprocessor Trend Data","author":"Rupp"},{"key":"ref4","volume-title":"List of Nvidia graphics processing units"},{"key":"ref5","volume-title":"List of AMD graphics processing units"},{"key":"ref6","volume-title":"Top #1 Systems"},{"key":"ref7","volume-title":"How Much Power Does A Nuclear Reactor Produce?"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366060"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731536"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310173"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063103"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731565"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3064030"},{"key":"ref14","article-title":"Tackling the test challenges of the chiplet revolution","author":"Rearick","year":"2021","journal-title":"ITC"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/SaPIW.2018.8401666"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.348"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1077603.1077645"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ICRC.2017.8123669"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2021.3128243"},{"key":"ref20","volume-title":"UCle 1.0 Specification"},{"key":"ref21","volume-title":"CXL 3.0 Specification"},{"key":"ref22","article-title":"A 0.96pJ\/b 7x50Gb\/s-per-Fiber WDM Receiver with Stacked 7nm CMOS and 45nm Silicon Photonic Dies","author":"Raj","year":"2023","journal-title":"ISSCC"},{"key":"ref23","volume-title":"Frontier User Guide"},{"key":"ref24","volume-title":"BFloat16: The Secret to High Performance on Cloud TPUs","author":"Wang","year":"2019"},{"key":"ref25","article-title":"Training Deep Neural Networks with 8-bit Floating Point Numbers","volume-title":"32nd Conference on Neural Information Processing Systems","author":"Wang"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1021\/acscentsci.9b00576"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/IPDPSW55747.2022.00222"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731643"}],"event":{"name":"2023 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,2,19]]},"end":{"date-parts":[[2023,2,23]]}},"container-title":["2023 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10067248\/10067251\/10067810.pdf?arnumber=10067810","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,13]],"date-time":"2024-02-13T13:56:42Z","timestamp":1707832602000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10067810\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,2,19]]},"references-count":28,"URL":"https:\/\/doi.org\/10.1109\/isscc42615.2023.10067810","relation":{},"subject":[],"published":{"date-parts":[[2023,2,19]]}}}