{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,12]],"date-time":"2026-06-12T16:53:57Z","timestamp":1781283237059,"version":"3.54.1"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,2,18]],"date-time":"2024-02-18T00:00:00Z","timestamp":1708214400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,2,18]],"date-time":"2024-02-18T00:00:00Z","timestamp":1708214400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,2,18]]},"DOI":"10.1109\/isscc49657.2024.10454534","type":"proceedings-article","created":{"date-parts":[[2024,3,13]],"date-time":"2024-03-13T18:55:39Z","timestamp":1710356139000},"page":"132-134","source":"Crossref","is-referenced-by-count":11,"title":["7.5 A 224Gb\/s\/wire Single-Ended PAM-4 Transceiver Front-End with 29dB Equalization for 800GbE\/1.6TbE"],"prefix":"10.1109","author":[{"given":"Xiongshi","family":"Luo","sequence":"first","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xuewei","family":"You","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhenghao","family":"Li","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hamed","family":"Mosalam","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dongfan","family":"Xu","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Taiyang","family":"Fan","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hongchang","family":"Qiao","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wentao","family":"Zhou","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hongzhi","family":"Wu","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Liping","family":"Zhong","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Patrick Yin","family":"Chiang","sequence":"additional","affiliation":[{"name":"Fudan University,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Quan","family":"Pan","sequence":"additional","affiliation":[{"name":"Southern University of Science and Technology,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","journal-title":"Next Generation CEI-224G Framework"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366048"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067477"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3232024"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365752"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731794"}],"event":{"name":"2024 IEEE International Solid-State Circuits Conference (ISSCC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2024,2,18]]},"end":{"date-parts":[[2024,2,22]]}},"container-title":["2024 IEEE International Solid-State Circuits Conference (ISSCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10454133\/10454267\/10454534.pdf?arnumber=10454534","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,26]],"date-time":"2024-03-26T11:56:20Z","timestamp":1711454180000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10454534\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2,18]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isscc49657.2024.10454534","relation":{},"subject":[],"published":{"date-parts":[[2024,2,18]]}}}